Method for wave soldering of surface mounted light emitting diodes
AssigneeVisteon Global Technologies, Inc.
InventorsChristopher L. Rovik, Wesley R. Corrion, Ricardo Hernandez, Adrian G. Gheorghiu
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AssigneeVisteon Global Technologies, Inc.
InventorsChristopher L. Rovik, Wesley R. Corrion, Ricardo Hernandez, Adrian G. Gheorghiu
Estimating the term…
An instrument cluster for communicating a vehicle's operating status to a vehicle occupant is disclosed. The instrument cluster includes a housing for supporting the instrument cluster. The housing is mountable to a vehicle instrument panel. A circuit board is secured to the housing. A motor having a motor shaft is rotatably coupled to the motor and the motor is secured to the circuit board. A gauge pointer is mounted on the motor shaft and rotatable therewith for indicating the vehicle's operating status. At least one diode is provided for illuminating the gauge pointer and at least one diode “footprint” is disposed on the circuit board proximate the motor shaft for electrically interconnecting the at least one diode to the circuit board. The at least one diode “footprint” has a cathode solder pad and an anode solder pad. The anode solder pad is substantially rectangular and the cathode solder pad is substantially L-shaped.
An instrument cluster for communicating a vehicle's operating status to a vehicle occupant, the instrument cluster comprising:
A method of wave soldering an electronic component on an instrument cluster circuit board, the method comprising:
Dependencies are inferred from the claim text.