Nozzle for ejecting molten metal
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsJyunichi Aizawa, Hiroshi Fukumoto, Yasufumi Nakasu
Life of this patent
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Abstract
A nozzle ejects molten metal in an ejecting direction. The nozzle has a solder-philic surface in a first region and a solder-repellent surface in a second region. The second region is located forward of the first region in the ejecting direction. Before molten metal is ejected, the peripheral edge of the liquid surface of the molten metal is held at a position located further forward in the ejecting direction than the boundary between the solder-philic surface and the solder-repellent surface. The peripheral edge of the liquid surface is thus held before being ejected so that solder drops can be ejected steadily with a uniform diameter, constant direction, and constant speed.
Claims13
A nozzle for ejecting a molten metal in an ejecting direction, comprising:
- a metal-philic surface on which a molten metal forms a contact angle smaller than 90°;
- and
- a metal-repellent surface on which the molten metal forms a contact angle larger than 90°, said metal-repellent surface being located forward of said metal-philic surface relative to an ejecting direction, wherein, before ejecting the molten metal from said nozzle, said nozzle holds a peripheral edge of a liquid surface of said molten metal at a position further forward in the ejecting direction than a boundary between said metal-philic surface and said metal-repellent surface.
Dependencies are inferred from the claim text.