Wirebonding insulated wire
AssigneeFreescale Semiconductor, Inc.
InventorsFuaida Harun, Kong Bee Tiu
Life of this patent
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Abstract
An electrical connection for connecting a bond pad of a first device and a bond pad of a second device with an insulated or coated wire. The electrical connection includes a first wirebond securing a first portion of the insulated bond wire to the first device bond pad. A second wirebond secures a second portion of the insulated bond wire to the second device bond pad. A bump is formed over the second wirebond, and the bump is offset from the second wirebond. The offset bump enhances the second bond, providing it with increased wire peel strength.
Claims23
A method of electrically connecting a first device to a second device, the method comprising the steps of:
- forming a first bond by wirebonding a first portion of an insulated wire to a bond pad of the first device, thereby electrically connecting the bond wire and the first device;
- forming a second bond by wirebonding a second portion of the insulated wire to a bond pad of the second device, thereby electrically connecting the first device and the second device;
- and
- forming a bump on the second bond, and bond pad of the second device, wherein the bump is offset from a center of the second bond.
A method of enhancing the strength of a second wire bond of a coated wire wedge bonded to a lead, the method comprising the steps of:
- forming a bump on the second bond and the lead, wherein the bump is offset from a center of the second bond.
An electrical connection for connecting a bond pad of a first device and a bond pad of a second device, the electrical connection comprising:
- a first wirebond securing a first portion of an insulated bond wire to the first device bond pad;
- a second wirebond securing a second portion of the insulated bond wire to the second device bond pad;
- and
- a bump formed over the second wirebond and on the second device bond pad, wherein the bump is offset from the second wirebond.
Dependencies are inferred from the claim text.