Modification of circuit features that are interior to a packaged integrated circuit
AssigneeAgilent Technologies, Inc.
InventorsAlbert An-Bon Yeh, Regina Nora Pabilonia, Robert William Kressin, Wei Liu
Life of this patent
Estimating the term…
Abstract
A circuit feature that is interior to a packaged integrated circuit is modified by first identifying a trimming point on the interior circuit feature using an x-ray inspection system. Coordinates of the trimming point are then related to the coordinates of a visible reference marker. The relationship between the visible reference marker and the trimming point is then used to position a cutting tool over the trimming point. Finally, the cutting tool is used to make one or more cuts into the packaged integrated circuit, until the interior circuit feature has been acceptably modified at the trimming point.
Claims15
A method for modifying a circuit feature that is interior to a packaged integrated circuit, comprising:
- a) identifying a trimming point on the interior circuit feature using an x-ray inspection system;
- b) relating coordinates of the trimming point to coordinates of a visible reference marker;
- c) utilizing the relationship between the visible reference marker and the trimming point to position a cutting tool over the trimming point;
- and
- d) utilizing the cutting tool to make one or more cuts into the packaged integrated circuit, until the interior circuit feature has been acceptably modified at the trimming point.
Dependencies are inferred from the claim text.