Process for manufacturing a composite polymeric circuit protection device

A process for manufacturing a composite polymeric circuit protection device, said process comprising

• (1) providing a polymeric assembly comprising
• (a) providing first and second laminates, each of which comprises a laminar polymer element having at least one conductive surface, the laminar polymer element in the first laminate comprising a PTC conductive polymer composition and the laminar polymer element in the second laminate comprising a dielectric material;
• (b) providing a pattern of conductive material on at least one of the conductive surfaces on one laminate;
• (c) securing the laminates in a stack in a desired configuration, at least one conductive surface of at least one of the laminates comprising an external conductive surface of the stack,
• (d) making a plurality of electrical connections between a conductive surface of the first laminate and a conductive surface of the second laminate, and
• (e) attaching a plurality of electrical components to the external conductive surface of the stack;
• and
• (2) subdividing the assembly into individual devices each of which comprises (i) at least one electrical connection, and (ii) at least one electrical component.

A process for manufacturing a composite polymeric circuit protection device, said process comprising

• (1) providing a polymeric assembly comprising
• (a) providing first and second laminates, each of which comprises a laminar polymer element having at least one conductive surface, the laminar polymer element in the first laminate comprising a PTC conductive polymer composition and the laminar polymer element in the second laminate comprising a dielectric material,
• (b) providing a pattern of conductive material on at least one of the conductive surfaces on one laminate;
• (c) securing the laminates in a stack in a desired configuration, at least one conductive surface of at least one of the laminates comprising an external conductive surface of the stack,
• (d) making a plurality of electrical connections between a conductive surface of the first laminate and a conductive surface of the second laminate;
• (2) subdividing the assembly into individual devices each of which comprises at least one electrical connection;
• and
• (3) attaching at least one electrical component to an external conductive surface of each device.

A process for manufacturing a composite polymeric circuit protection device, said process comprising

• (1) providing a polymeric assembly comprising
• (a) providing a first laminate which comprises a laminar polymer element comprising a conductive polymer composition, said laminar polymer element having at least one conductive surface,
• (b) providing a second laminate which comprises a laminar polymer element comprising an insulating polymer composition, said laminar polymer element having at least one conductive surface,
• (c) providing a pattern of conductive material on at least one of the conductive surfaces on one laminate;
• (d) securing the laminates in a stack in a desired configuration, at least one conductive surface of at least one of the laminates comprising an external conductive surface of the stack,
• (e) making a plurality of electrical connections between a conductive surface of the first laminate and a conductive surface of the second laminate, and
• (f) providing an additional conductive layer on at least part of at least one of the external conductive surfaces to form an electrical connection pad or a reconnectable contact pad;
• and
• (2) subdividing the assembly into individual devices each of which comprises (i) at least one electrical connection, and (ii) at least one electrical connection pad or reconnectable contact pad.