RRAM memory cell electrodes
AssigneeSharp Laboratories of America, Inc.
InventorsSheng Teng Hsu, Wei Pan, Fengyan Zhang, Wei-Wei Zhuang, Tingkai Li
Life of this patent
Estimating the term…
Loading patent…
AssigneeSharp Laboratories of America, Inc.
InventorsSheng Teng Hsu, Wei Pan, Fengyan Zhang, Wei-Wei Zhuang, Tingkai Li
Estimating the term…
A RRAM memory cell is formed on a silicon substrate having a operative junction therein and a metal plug formed thereon, includes a first oxidation resistive layer; a first refractory metal layer; a CMR layer; a second refractory metal layer; and a second oxidation resistive layer. A method of fabricating a multi-layer electrode RRAM memory cell includes preparing a silicon substrate; forming a junction in the substrate taken from the group of junctions consisting of N+ junctions and P+ junctions; depositing a metal plug on the junction; depositing a first oxidation resistant layer on the metal plug; depositing a first refractory metal layer on the first oxidation resistant layer; depositing a CMR layer on the first refractory metal layer; depositing a second refractory metal layer on the CMR layer; depositing a second oxidation resistant layer on the second refractory metal layer; and completing the RRAM memory cell.
A RRAM memory cell formed on a silicon substrate having a operative junction formed therein and a metal plug formed on the operative junction, comprising:
A method of fabricating a multi-layer electrode RRAM memory cell comprising:
The method of 13 wherein said depositing a CMR layer includes depositing a layer of CMR material having a thickness of between about 50 nm to 300 nm.
Dependencies are inferred from the claim text.