Bond strength measurement system using shock loads

A method for measuring bonded joint minimum strength, the method comprising the steps of:

• (a) generating internal stress leading to surface motions proximate a bonded assembly;
• (b) measuring the surface motions;
• (c) correlating the surface motions with the minimum strength of the bonded joint;
• and
• wherein the surface motions are measured with a laser interferometer.

A system for measuring bonded joint strength, the system comprising:

• a source of rapid surface pressure application;
• a surface motion detector;
• wherein when the source of rapid surface pressure application is positioned adjacent a bonded assembly and activated to impart a rapid pressure on a surface of the bonded assembly containing the bonded joint to create a shock load, such that the shock load generates compression and then tension within the bonded joint and surface motions proximate the bonded assembly, and the surface motion detector measures the surface motions to determine the minimum strength of the bonded joint;
• and
• wherein the surface motion detector comprises a laser interferometer.

A system for measuring bonded joint strength, the system comprising:

• (a) a source for generating internal stress;
• (b) a device for measuring surface motion;
• wherein when the source for generating internal stress is activated to impart internal stress in the bonded joint, compression and then tension forces within the bonded joint cause surface motions that are measured by said device for measuring surface motion;
• wherein said device for measuring surface motion includes a laser interferometer.