Honeycomb structure thermal barrier coating
AssigneeSiemens Westinghouse Power Corporation
InventorRamesh Subramanian
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AssigneeSiemens Westinghouse Power Corporation
InventorRamesh Subramanian
Estimating the term…
A device having an improved thermal barrier coating (46) and a process for manufacturing the same. A support structure (28) for retaining a ceramic insulating material (46) on a substrate (16) is formed by the deposition of a support structure material through a patterned masking material (14). The support structure can define cells into which the ceramic insulating material is deposited following removal of the masking material. The masking material may be patterned by known photolithographic techniques (22,24) or by laser etching (48). The support structure (28) may be a composite metal-ceramic material having either discreet layers (30,34) or a graded composition and may be deposited by an electro-desposition process followed by a heat treatment to form a solid state diffusion bond with the substrate. The ceramic filler material may be deposited (44) by the electrophoretic deposition of ceramic particles coated with a bonding material that is subsequently heated to oxidize and to bond the particles together. The support structure may be provided with included walls in order to improve its resistance to foreign object impact damage.
A device adapted for exposure to high temperatures, the device comprising:
A device adapted for exposure to high temperatures, the device comprising:
A device adapted for exposure to high temperatures, the device comprising:
A device adapted for exposure to high temperatures, the device comprising:
Dependencies are inferred from the claim text.