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US 6,844,978 B2Granted
Wafer level creation of multiple optical elements
AssigneeDigital Optics Corporation
InventorsBrian Harden, Alan Kathman, Michael Feldman
Life of this patent
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Abstract
Integrated multiple optical elements may be formed by bonding substrates containing such optical elements together or by providing optical elements on either side of the wafer substrate. The wafer is subsequently diced to obtain the individual units themselves. The optical elements may be formed lithographically, directly, or using a lithographically generated master to emboss the elements. Alignment features facilitate the efficient production of such integrated multiple optical elements, as well as post creation processing thereof on the wafer level.
Claims13
An optical element comprising:
- a substrate having a first surface and a second surface;
- a first optical element having optical power therein on one of the first and second surfaces, the first optical element being a lithograph;
- and
- a feature, in addition to the first optical element, on at least one of the first and second surfaces, the feature being created by simultaneously removing or adding material from the at least one of the first and second surfaces.
1 more element
Dependencies are inferred from the claim text.