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US 6,835,523 B1Granted
Apparatus for fabricating coating and method of fabricating the coating
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorsShunpei Yamazaki, Kenji Itoh, Shigenori Hayashi
Life of this patent
Estimating the term…
Abstract
In an apparatus for fabricating a carbon coating, an object such as a magnetic r cording medium is disposed on a side of an electrode connected to a high-frequency power supply. Ultrasonic vibrations are supplied to the object. Discharge is generated between the electrode connected to the high-frequency power supply and a grounded electrode to fabricate a carbon coating on the surface of the object. Also, an electrode interval is set to 6 mm or less, pressure between the electrodes is set to 15 Torr to 100 Torr, whereby high-density plasma is generated to form an ion sheath on an anode side. Therefore, a coating is fabricated on the surface of the object by bombardment of ions.
Claims148
A method for operating an optically recordable disk memory comprising the steps of:
- introducing an optical disk having a surface protected by a protective film comprising a hard-carbon coating having a thickness of 500 Å or less;
- irradiating a semiconductor laser light onto said optical disk through said hard-carbon coating;
- wherein the number of pin-holes in said hard-carbon coating is 30/mm2 or less, wherein said hard-carbon coating is an outermost layer of the disk, and wherein said hard-carbon coating contains hydrogen;
- wherein
- said hard-carbon coating contains silicon and phosphorus.
2 more elements
A method for operating an optically recordable disk memory comprising the steps of:
- introducing an optical disk having a surface protected by a protective film comprising a hard-carbon coating having a thickness of 500 Å or less;
- irradiating a semiconductor laser light onto said optical disk through said hard-carbon coating;
- wherein the number of pin-holes in said hard-carbon coating is 30/mm2 or less;
- wherein said hard-carbon coating contains silicon and phosphorus at a concentration at 20 atomic % or less.
1 more element
A method for operating an optically recordable disk memory comprising the steps of:
- introducing a substrate made of an organic resin or an industrial plastic material, said substrate having a surface protected by a protective film comprising a hard-carbon coating having a thickness of 500 Å or less;
- irradiating a semiconductor laser light onto said substrate through said hard-carbon coating;
- wherein the number of pin-holes in said hard-carbon coating is 30/mm2 or less, wherein said hard-carbon coating is an outermost layer of the disk, and wherein said hard-carbon coating contains hydrogen;
- wherein said hard-carbon coating contains silicon and phosphorus.
1 more element
A method for operating an optically recordable disk memory comprising the steps of:
- introducing a substrate made of an organic resin or an industrial plastic material, said substrate having a surface protected by a protective film comprising a hard-carbon coating having a thickness of 500 Å or less;
- irradiating a semiconductor laser light onto said substrate through said hard-carbon coating;
- wherein the number of pin-holes in said hard-carbon coating is 30/mm2 or less;
- wherein said hard-carbon coating contains silicon and phosphorus at a concentration at 20 atomic % or less.
1 more element
A method for operating an optically recordable disk memory comprising the steps of:
- introducing an optical disk having a surface protected by a protective film comprising a hard-carbon coating having a thickness of 500 Å or less;
- irradiating a laser light having a wavelength of 700 to 800 nm onto said optical disk through said hard-carbon coating;
- wherein the number of pin-holes in said hard-carbon coating is 30/mm2 or less, wherein said hard-carbon coating is an outermost layer of the disk, and wherein said hard-carbon coating contains hydrogen;
- wherein said hard-carbon coating contains silicon and phosphorus.
1 more element
A method for operating an optically recordable disk memory comprising the steps of:
- introducing an optical disk having a surface protected by a protective film comprising a hard-carbon coating having a thickness of 500 Å or less;
- irradiating a laser light having a wavelength of 700 to 800 nm onto said optical disk through said hard-carbon coating;
- wherein the number of pin-holes in said hard-carbon coating is 30/mm2 or less;
- wherein said hard-carbon coating contains silicon and phosphorus at a concentration at 20 atomic % or less.
1 more element
A method for operating an optically recordable disk memory comprising the steps of:
- introducing a substrate made of an organic resin or an industrial plastic material, said substrate having a surface protected by a protective film comprising a hard-carbon coating having a thickness of 500 Å or less;
- irradiating a laser light having a wavelength of 700 to 800 nm onto said substrate through said hard-carbon coating;
- wherein the number of pin-holes in said hard-carbon coating is 30/mm2 or less, wherein said hard-carbon coating is an outermost layer of the disk, and wherein said hard-carbon coating contains hydrogen;
- wherein said hard-carbon coating contains silicon and phosphorus.
1 more element
A method for operating an optically recordable disk memory comprising the steps of:
- introducing a substrate made of an organic resin or an industrial plastic material, said substrate having a surface protected by a protective film comprising a hard-carbon coating having a thickness of 500 Å or less;
- irradiating a laser light having a wavelength of 700 to 800 nm onto said substrate through said hard-carbon coating;
- wherein the number of pin-holes in said hard-carbon coating is 30/mm2 or less;
- wherein said hard-carbon coating contains silicon and phosphorus at a concentration at 20 atomic % or less.
1 more element
A method for operating an optically recordable disk memory comprising the steps of:
- introducing an optical disk having a surface protected by a protective film comprising a hard-carbon coating having a thickness of 500 Å or less;
- irradiating a visible light onto said optical disk through said hard-carbon coating;
- wherein the number of pin-holes in said hard-carbon coating is 30/mm2 or less, wherein said hard-carbon coating is an outermost layer of the disk, and wherein said hard-carbon coating contains hydrogen;
- wherein said hard-carbon coating contains silicon and phosphorus.
1 more element
A method for operating an optically recordable disk memory comprising the steps of:
- introducing an optical disk having a surface protected by a protective film comprising a hard-carbon coating having a thickness of 500 Å or less;
- irradiating a visible light onto said optical disk through said hard-carbon coating;
- wherein the number of pin-holes in said hard-carbon coating is 30/mm2 or less;
- wherein said hard-carbon coating contains silicon and phosphorus at a concentration at 20 atomic % or less.
1 more element
A method for operating an optically recordable disk memory comprising the steps of:
- introducing a substrate made of an organic resin or an industrial plastic material, said substrate having a surface protected by a protective film comprising a hard-carbon coating having a thickness of 500 Å or less;
- irradiating a visible light onto said substrate through said hard-carbon coating;
- wherein the number of pin-holes in said hard-carbon coating is 30/mm2 or less, wherein said hard-carbon coating is an outermost layer of the disk, and wherein said hard-carbon coating contains hydrogen;
- wherein said hard-carbon coating contains silicon and phosphorus.
1 more element
A method for operating an optically recordable disk memory comprising the steps of:
- introducing a substrate made of an organic resin or an industrial plastic material, said substrate having a surface protected by a protective film comprising a hard-carbon coating having a thickness of 500 Å or less;
- irradiating a visible light onto said substrate through said hard-carbon coating;
- wherein the number of pin-holes in said hard-carbon coating is 30/mm2 or less;
- wherein said hard-carbon coating contains silicon and phosphorus at a concentration at 20 atomic % or less.
1 more element
A method of operating an optical magnetic disk comprising the steps of:
- introducing an optical disk having a surface protected by a protective film comprising a hard-carbon coating having a thickness of 500 Å or less;
- irradiating a semiconductor laser light onto said optical disk through said hard-carbon coating;
- wherein the number of pin-holes in said hard-carbon coating is 30/mm2 or less, wherein said hard-carbon coating is an outermost layer of the disk, and wherein said hard-carbon coating contains hydrogen;
- wherein said hard-carbon coating contains silicon and phosphorus.
1 more element
A method of operating an optical magnetic disk comprising the steps of:
- introducing an optical disk having a surface protected by a protective film comprising a hard-carbon coating having a thickness of 500 Å or less;
- irradiating a semiconductor laser light onto said optical disk through said hard-carbon coating;
- wherein the number of pin-holes in said hard-carbon coating is 30/mm2 or less,
- wherein said hard-carbon coating contains silicon and phosphorus at a concentration at 20 atomic % or less.
1 more element
A method of operating an optical magnetic disk comprising the steps of:
- introducing a substrate made of an organic resin or an industrial plastic material, said substrate having a surface protected by a protective film comprising a hard-carbon coating having a thickness of 500 Å or less;
- irradiating a semiconductor laser light onto said substrate through said hard-carbon coating;
- wherein the number of pin-holes in said hard-carbon coating is 30/mm2 or less, wherein said hard-carbon coating is an outermost layer of the disk, and wherein said hard-carbon coating contains hydrogen;
- wherein said hard-carbon coating contains silicon and phosphorus.
1 more element
A method of operating an optical magnetic disk comprising the steps of:
- introducing a substrate made of an organic resin or an industrial plastic material, said substrate having a surface protected by a protective film comprising a hard-carbon coating having a thickness of 500 Å or less;
- irradiating a semiconductor laser light onto said substrate through said hard-carbon coating;
- wherein the number of pin-holes in said hard-carbon coating is 30/mm2 or less;
- wherein said hard-carbon coating contains silicon and phosphorus at a concentration at 20 atomic % or less.
1 more element
A method of operating an optical magnetic disk comprising the steps of:
- introducing an optical disk having a surface protected by a protective film comprising a hard-carbon coating having a thickness of 500 Å or less;
- irradiating a laser light having a wavelength of 700 to 800 nm onto said optical disk through said hard-carbon coating;
- wherein the number of pin-holes in said hard-carbon coating is 30/mm2 or less and wherein said hard-carbon coating contains hydrogen;
- wherein said hard-carbon coating contains silicon and phosphorus.
1 more element
A method of operating an optical magnetic disk comprising the steps of:
- introducing an optical disk having a surface protected by a protective film comprising a hard-carbon coating having a thickness of 500 Å or less;
- irradiating a laser light having a wavelength of 700 to 800 nm onto said optical disk through said hard-carbon coating;
- wherein the number of pin-holes in said hard-carbon coating is 30/mm2 or less,
- wherein said hard-carbon coating contains silicon and phosphorus at a concentration at 20 atomic % or less.
1 more element
A method of operating an optical magnetic disk comprising the steps of:
- introducing a substrate made of an organic resin or an industrial plastic material, said substrate having a surface protected by a protective film comprising a hard-carbon coating having a thickness of 500 Å or less;
- irradiating a laser light having a wavelength of 700 to 800 nm onto said substrate through said hard-carbon coating;
- wherein the number of pin-holes in said hard-carbon coating is 30/mm2 or less, wherein said hard-carbon coating is an outermost layer of the disk, and wherein said hard-carbon coating contains hydrogen;
- wherein said hard-carbon coating contains silicon and phosphorus.
1 more element
A method of operating an optical magnetic disk comprising the steps of:
- introducing a substrate made of an organic resin or an industrial plastic material, said substrate having a surface protected by a protective film comprising a hard-carbon coating having a thickness of 500 Å or less;
- irradiating a laser light having a wavelength of 700 to 800 nm onto said substrate through said hard-carbon coating;
- wherein the number of pin-holes in said hard-carbon coating is 30/mm2 or less;
- wherein said hard-carbon coating contains silicon and phosphorus at a concentration at 20 atomic % or less.
1 more element
A method of operating an optical magnetic disk comprising the steps of:
- introducing an optical disk having a surface protected by a protective film comprising a hard-carbon coating having a thickness of 500 Å or less;
- irradiating a visible light onto said optical disk through said hard-carbon coating;
- wherein the number of pin-holes in said hard-carbon coating is 30/mm2 or less, wherein said hard-carbon coating is an outermost layer of the disk, and wherein said hard-carbon coating contains hydrogen;
- wherein said hard-carbon coating contains silicon and phosphorus.
1 more element
A method of operating an optical magnetic disk comprising the steps of:
- introducing an optical disk having a surface protected by a protective film comprising a hard-carbon coating having a thickness of 500 Å or less;
- irradiating a visible light onto said optical disk through said hard-carbon coating;
- wherein the number of pin-holes in said hard-carbon coating is 30/mm2 or less,
- wherein said hard-carbon coating contains silicon and phosphorus at a concentration at 20 atomic % or less.
1 more element
A method of operating an optical magnetic disk comprising the steps of:
- introducing a substrate made of an organic resin or an industrial plastic material, said substrate having a surface protected by a protective film comprising a hard-carbon coating having a thickness of 500 Å or less;
- irradiating a visible light onto said substrate through said hard-carbon coating;
- wherein the number of pin-holes in said hard-carbon coating is 30/mm2 or less, wherein said hard-carbon coating is an outermost layer of the disk, and wherein said hard-carbon coating contains hydrogen;
- wherein said hard-carbon coating contains silicon and phosphorus.
1 more element
A method of operating an optical magnetic disk comprising the steps of:
- introducing a substrate made of an organic resin or an industrial plastic material, said substrate having a surface protected by a protective film comprising a hard-carbon coating having a thickness of 500 Å or less;
- irradiating a visible light onto said substrate through said hard-carbon coating;
- wherein the number of pin-holes in said hard-carbon coating is 30/mm2 or less;
- wherein said hard-carbon coating contains silicon and phosphorus at a concentration at 20 atomic % or less.
1 more element
A method of operating a compact disk comprising the steps of:
- introducing an optical disk having a surface protected by a protective film comprising a hard-carbon coating having a thickness of 500 Å or less;
- irradiating a semiconductor laser light onto said optical disk through said hard-carbon coating;
- wherein the number of pin-holes in said hard-carbon coating is 30/mm2 or less, wherein said hard-carbon coating is an outermost layer of the disk, and wherein said hard-carbon coating contains hydrogen;
- wherein said hard-carbon coating contains silicon and phosphorus.
1 more element
A method of operating a compact disk comprising the steps of:
- introducing an optical disk having a surface protected by a protective film comprising a hard-carbon coating having a thickness of 500 Å or less;
- irradiating a semiconductor laser light onto said optical disk through said hard-carbon coating;
- wherein the number of pin-holes in said hard-carbon coating is 30/mm2 or less,
- wherein said hard-carbon coating contains silicon and phosphorus at a concentration at 20 atomic % or less.
1 more element
A method of operating a compact disk comprising the steps of:
- introducing a substrate made of an organic resin or an industrial plastic material, said substrate having a surface protected by a protective film comprising a hard-carbon coating having a thickness of 500 Å or less;
- irradiating a semiconductor laser light onto said substrate through said hard-carbon coating;
- wherein the number of pin-holes in said hard-carbon coating is 30/mm2 or less, wherein said hard-carbon coating is an outermost layer of the disk, and wherein said hard-carbon coating contains hydrogen;
- wherein said hard-carbon coating contains silicon and phosphorus.
1 more element
A method of operating a compact disk comprising the steps of:
- introducing a substrate made of an organic resin or an industrial plastic material, said substrate having a surface protected by a protective film comprising a hard-carbon coating having a thickness of 500 Å or less;
- irradiating a semiconductor laser light onto said substrate through said hard-carbon coating;
- wherein the number of pin-holes in said hard-carbon coating is 30/mm2 or less;
- wherein said hard-carbon coating contains silicon and phosphorus at a concentration at 20 atomic % or less.
1 more element
A method of operating a compact disk comprising the steps of:
- introducing an optical disk having a surface protected by a protective film comprising a hard-carbon coating having a thickness of 500 Å or less;
- irradiating a laser light having a wavelength of 700 to 800 nm onto said optical disk through said hard-carbon coating;
- wherein the number of pin-holes in said hard-carbon coating is 30/mm2 or less, wherein said hard-carbon coating is an outermost layer of the disk, and wherein said hard-carbon coating contains hydrogen;
- wherein said hard-carbon coating contains silicon and phosphorus.
1 more element
A method of operating a compact disk comprising the steps of:
- introducing an optical disk having a surface protected by a protective film comprising a hard-carbon coating having a thickness of 500 Å or less;
- irradiating a laser light having a wavelength of 700 to 800 nm onto said optical disk through said hard-carbon coating;
- wherein the number of pin-holes in said hard-carbon coating is 30/mm2 or less,
- wherein said hard-carbon coating contains silicon and phosphorus at a concentration at 20 atomic % or less.
1 more element
A method of operating a compact disk comprising the steps of:
- introducing a substrate made of an organic resin or an industrial plastic material, said substrate having a surface protected by a protective film comprising a hard-carbon coating having a thickness of 500 Å or less;
- irradiating a laser light having a wavelength of 700 to 800 nm onto said substrate through said hard-carbon coating;
- wherein the number of pin-holes in said hard-carbon coating is 30/mm2 or less, wherein said hard-carbon coating is an outermost layer of the disk, and wherein said hard-carbon coating contains hydrogen;
- wherein said hard-carbon coating contains silicon and phosphorus.
1 more element
A method of operating a compact disk comprising the steps of:
- introducing a substrate made of an organic resin or an industrial plastic material, said substrate having a surface protected by a protective film comprising a hard-carbon coating having a thickness of 500 Å or less;
- irradiating a laser light having a wavelength of 700 to 800 nm onto said substrate through said hard-carbon coating;
- wherein the number of pin-holes in said hard-carbon coating is 30/mm2 or less;
- wherein said hard-carbon coating contains silicon and phosphorus at a concentration at 20 atomic % or less.
1 more element
A method of operating a compact disk comprising the steps of:
- introducing an optical disk having a surface protected by a protective film comprising a hard-carbon coating having a thickness of 500 Å or less;
- irradiating a visible light onto said optical disk through said hard-carbon coating;
- wherein the number of pin-holes in said hard-carbon coating is 30/mm2 or less, wherein said hard-carbon coating is an outermost layer of the disk, and wherein said hard-carbon coating contains hydrogen;
- wherein said hard-carbon coating contains silicon and phosphorus.
1 more element
A method of operating a compact disk comprising the steps of:
- introducing an optical disk having a surface protected by a protective film comprising a hard-carbon coating having a thickness of 500 Å or less;
- irradiating a visible light onto said optical disk through said hard-carbon coating;
- wherein the number of pin-holes in said hard-carbon coating is 30/mm2 or less,
- wherein said hard-carbon coating contains silicon and phosphorus at a concentration at 20 atomic % or less.
1 more element
A method of operating a compact disk comprising the steps of:
- introducing a substrate made of an organic resin or an industrial plastic material, said substrate having a surface protected by a protective film comprising a hard-carbon coating having a thickness of 500 Å or less;
- irradiating a visible light onto said substrate through said hard-carbon coating;
- wherein the number of pin-holes in said hard-carbon coating is 30/mm2 or less, wherein said hard-carbon coating is an outermost layer of the disk, and wherein said hard-carbon coating contains hydrogen;
- wherein said hard-carbon coating contains silicon and phosphorus.
1 more element
A method of operating a compact disk comprising the steps of:
- introducing a substrate made of an organic resin or an industrial plastic material, said substrate having a surface protected by a protective film comprising a hard-carbon coating having a thickness of 500 Å or less;
- irradiating a visible light onto said substrate through said hard-carbon coating;
- wherein the number of pin-holes in said hard-carbon coating is 30/mm2 or less;
- wherein said hard-carbon coating contains silicon and phosphorus at a concentration at 20 atomic % or less.
1 more element
A method of operating an optical disk comprising the steps of:
- introducing said optical disk having a surface protected by a protective film comprising a hard-carbon coating having a thickness of 500 Å or less;
- irradiating a semiconductor laser light onto said optical disk through said hard-carbon coating;
- wherein the number of pin-holes in said hard-carbon coating is 30/mm2 or less, and wherein said hard-carbon coating contains hydrogen;
- wherein said hard-carbon coating contains silicon and phosphorus.
1 more element
A method of operating an optical disk comprising the steps of:
- introducing said optical disk having a surface protected by a protective film comprising a hard-carbon coating having a thickness of 500 Å or less;
- irradiating a semiconductor laser light onto said optical disk through said hard-carbon coating;
- wherein the number of pin-holes in said hard-carbon coating is 30/mm2 or less,
- wherein said hard-carbon coating contains silicon and phosphorus at a concentration at 20 atomic % or less.
1 more element
A method of operating an optical disk comprising the steps of:
- introducing a substrate made of an organic resin or an industrial plastic material, said substrate having a surface protected by a protective film comprising a hard-carbon coating having a thickness of 500 Å or less;
- irradiating a semiconductor laser light onto said substrate through said hard-carbon coating;
- wherein the number of pin-holes in said hard-carbon coating is 30/mm2 or less, wherein said hard-carbon coating is an outermost layer of the disk, and wherein said hard-carbon coating contains hydrogen;
- wherein said hard-carbon coating contains silicon and phosphorus.
1 more element
A method of operating an optical disk comprising the steps of:
- introducing a substrate made of an organic resin or an industrial plastic material, said substrate having a surface protected by a protective film comprising a hard-carbon coating having a thickness of 500 Å or less;
- irradiating a semiconductor laser light onto said substrate through said hard-carbon coating;
- wherein the number of pin-holes in said hard-carbon coating is 30/mm2 or less;
- wherein said hard-carbon coating contains silicon and phosphorus at a concentration at 20 atomic % or less.
1 more element
A method of operating an optical disk comprising the steps of:
- introducing said optical disk having a surface protected by a protective film comprising a hard-carbon coating having a thickness of 500 Å or less;
- irradiating a laser light having a wavelength of 700 to 800 nm onto said optical disk through said hard-carbon coating;
- wherein the number of pin-holes in said hard-carbon coating is 30/mm2 or less, wherein said hard-carbon coating is an outermost layer of the disk, and wherein said hard-carbon coating contains hydrogen;
- wherein said hard-carbon coating contains silicon and phosphorus.
1 more element
A method of operating an optical disk comprising the steps of:
- introducing said optical disk having a surface protected by a protective film comprising a hard-carbon coating having a thickness of 500 Å or less;
- irradiating a laser light having a wavelength of 700 to 800 nm onto said optical disk through said hard-carbon coating;
- wherein the number of pin-holes in said hard-carbon coating is 30/mm2 or less,
- wherein said hard-carbon coating contains silicon and phosphorus at a concentration at 20 atomic % or less.
1 more element
A method of operating an optical disk comprising the steps of:
- introducing a substrate made of an organic resin or an industrial plastic material, said substrate having a surface protected by a protective film comprising a hard-carbon coating having a thickness of 500 Å or less;
- irradiating a laser light having a wavelength of 700 to 800 nm onto said substrate through said hard-carbon coating;
- wherein the number of pin-holes in said hard-carbon coating is 30/mm2 or less, wherein said hard-carbon coating is an outermost layer of the disk, and wherein said hard-carbon coating contains hydrogen;
- wherein said hard-carbon coating contains silicon and phosphorus.
1 more element
A method of operating an optical disk comprising the steps of:
- introducing a substrate made of an organic resin or an industrial plastic material, said substrate having a surface protected by a protective film comprising a hard-carbon coating having a thickness of 500 Å or less;
- irradiating a laser light having a wavelength of 700 to 800 nm into said substrate through said hard-carbon coating;
- wherein the number of pin-holes in said hard-carbon coating is 30/mm2 or less;
- wherein said hard-carbon coating contains silicon and phosphorus at a concentration at 20 atomic % or less.
1 more element
A method of operating an optical disk comprising the steps of:
- introducing said optical disk having a surface protected by a protective film comprising a hard-carbon coating having a thickness of 500 Å or less;
- irradiating a visible light onto said optical disk through said hard-carbon coating;
- wherein the number of pin-holes in said hard-carbon coating is 30/mm2 or less, wherein said hard-carbon coating is an outermost layer of the disk, and wherein said hard-carbon coating contains hydrogen;
- wherein said hard-carbon coating contains silicon and phosphorus.
1 more element
A method of operating an optical disk comprising the steps of:
- introducing said optical disk having a surface protected by a protective film comprising a hard-carbon coating having a thickness of 500 Å or less;
- irradiating a visible light onto said optical disk through said hard-carbon coating;
- wherein the number of pin-holes in said hard-carbon coating is 30/mm2 or less,
- wherein said hard-carbon coating contains silicon and phosphorus at a concentration at 20 atomic % or less.
1 more element
A method of operating an optical disk comprising the steps of:
- introducing a substrate made of an organic resin or an industrial plastic material, said substrate having a surface protected by a protective film comprising a hard-carbon coating having a thickness of 500 Å or less;
- irradiating a visible light onto said substrate through said hard-carbon coating;
- wherein the number of pin-holes in said hard-carbon coating is 30/mm2 or less, wherein said hard-carbon coating is an outermost layer of the disk, and wherein said hard-carbon coating contains hydrogen;
- wherein said hard-carbon coating contains silicon and phosphorus.
1 more element
A method of operating an optical disk comprising the steps of:
- introducing a substrate made of an organic resin or an industrial plastic material, said substrate having a surface protected by a protective film comprising a hard-carbon coating having a thickness of 500 Å or less;
- irradiating a visible light onto said substrate through said hard-carbon coating;
- wherein the number of pin-holes in said hard-carbon coating is 30/mm2 or less;
- wherein said hard-carbon coating contains silicon and phosphorus at a concentration at 20 atomic % or less.
1 more element
Dependencies are inferred from the claim text.