Automated EMC-driven layout and floor planning of electronic devices and systems
AssigneeQUALCOMM Incorporated
InventorMehyar Khazei
Life of this patent
Estimating the term…
Abstract
A method, system, and apparatus for automated electromagnetic compatibility-driven (EMC-driven) layout and floor planning of electronic devices and systems accounts for electromagnetic interactions between circuit components and addresses internal EMC issues at the outset of the design phase. Problems that may affect system performance are predicted, and a new layout optimized for reduced electromagnetic interference may be suggested, before an expensive prototyping operation is performed. Causes of such problems are also identified with better certainty than is possible from a defective prototype, resulting in a reduced design cycle.
Claims50
An apparatus for electromagnetic compatibility-driven design, said apparatus comprising:
- an electromagnetic field calculator configured and arranged to receive (A) placement information relating to a relative placement of a plurality of circuit components and (B) at least one emissions profile, each emissions profile corresponding to one among the plurality of circuit components;
- and
- an electromagnetic interference calculator coupled to the electromagnetic field calculator and configured and arranged to receive at least one susceptibility profile, each susceptibility profile corresponding to one among the plurality of circuit components,
- wherein the electromagnetic field calculator is further configured and arranged to output information regarding an induced electromagnetic field, and
- wherein the electromagnetic interference calculator is further configured and arranged to receive the information regarding an induced electromagnetic field and to output information regarding effects caused by the induced electromagnetic field;
- wherein each among said at least one emissions profile includes results of a plurality of electromagnetic near-field measurements, and
- wherein for at least one emissions profile, each among said plurality of electromagnetic near-field measurements is associated with a location in a grid, said grid having boundaries and at least two spatial dimensions, and
- wherein the information regarding an induced electromagnetic field includes a plurality of amplitudes of the induced electromagnetic field, and
- wherein each among the plurality of amplitudes corresponds to one among a plurality of spatial locations, and
- wherein at least one among the plurality of spatial locations lies outside the boundaries of said grid.
A method for electromagnetic compatibility-driven design, said method comprising:
- calculating an induced electromagnetic field based on (A) placement information relating to a relative placement of a plurality of circuit components and (B) at least one emissions profile, each emissions profile corresponding to one among the plurality of circuit components, and
- calculating effects of the induced electromagnetic field based on at least one susceptibility profile, each susceptibility profile corresponding to one among the plurality of circuit components,
- wherein each among said at least one emissions profile includes results of a plurality of electromagnetic near-field measurements, and
- wherein for at least one emissions profile, each among said plurality of electromaenetic near-field measurements is associated with a location in a grid said grid having boundaries and at least two spatial dimensions, and
- wherein the information regarding an induced electromagnetic field includes a plurality of amplitudes of the induced electromaenetic field, and
- wherein each among said plurality of amplitudes corresponds to one among a plurality of spatial locations, and
- wherein at least one among said plurality of spatial locations lies outside the boundaries of said grid.
A method for electromagnetic compatibility-driven design, said method comprising:
- receiving a circuit description including (A) at least one circuit component characterization, each circuit component characterization corresponding to at least one among a plurality of circuit components, and (B) connectivity information relating to at least one electrical pathway, each electrical pathway connecting at least two among the plurality of circuit components;
- based on the circuit description, calculating placement information relating to a relative placement of the plurality of circuit components;
- based on the placement information and at least one emissions profile, calculating an induced electromagnetic field;
- and
- based on at least one susceptibility profile, calculating effects of the induced electromagnetic field,
- wherein each emissions profile corresponds to one among the plurality of circuit components, and
- wherein each susceptibility profile corresponds to one among the plurality of circuit components,
- wherein each among said at least one emissions profile includes results of a plurality of electromagnetic near-field measurements, and
- wherein for at least one emissions profile, each among said plurality of electromagnetic near-field measurements is associated with a location in a d said grid having boundaries and at least two spatial dimensions, and
- wherein the information regarding an induced electromagnetic field includes a plurality of amplitudes of the induced electromagnetic field, and
- wherein each among said plurality of amplitudes corresponds to one among a plurality of spatial locations, and
- wherein at least one among said plurality of spatial locations lies outside the boundaries of said grid.
A data storage medium having machine-readable code, the machine-readable code including instructions executable by an array of logic elements, said instructions defining a method for electromagnetic compatibility-driven design comprising:
- calculating an induced electromagnetic field based on (A) placement information relating to a relative placement of a plurality of circuit components and (B) at least one emissions profile, each emissions profile corresponding to one among the plurality of circuit components, and
- calculating effects of the induced electromagnetic field based on at least one susceptibility profile, each susceptibility profile corresponding to one among the plurality of circuit components,
- wherein each among said at least one emissions profile includes results of a plurality of electromagnetic near-field measurements, and
- wherein for at least one emissions profile, each among said plurality of electromagnetic near-field measurements is associated with a location in a grid said grid having boundaries and at least two spatial dimensions, and
- wherein the information regarding an induced electromagnetic field includes a plurality of amplitudes of the induced electromagnetic field, and
- wherein each among said plurality of amplitudes corresponds to one among a plurality of spatial locations, and
- wherein at least one among said plurality of spatial locations lics outside the boundaries of said grid.
A data storage medium having machine-readable code, the machine-readable code including instructions executable by an array of logic elements, said instructions defining a method for electromagnetic compatibility-driven design, said method comprising:
- receiving a circuit description including (A) at least one circuit component characterization, each circuit component characterization corresponding to at least one among a plurality of circuit components, and (B) connectivity information relating to at least one electrical pathway, each electrical pathway connecting at least two among the plurality of circuit components;
- based on the circuit description, calculating placement information relating to a relative placement of the plurality of circuit components;
- based on the placement information and at least one emissions profile, calculating an induced electromagnetic field;
- and
- based on at least one susceptibility profile, calculating effects of the induced electromagnetic field,
- wherein each emissions profile corresponds to one among the plurality of circuit components, and
- wherein each susceptibility profile corresponds to one among the plurality of circuit components,
- wherein each among said at least one emissions profile includes results of a plurality of electromagnetic near-field measurements, and
- wherein for at least one emissions profile, each among said plurality of electromagnetic near-field measurements is associated with a location in a grid, said grid having boundaries and at least two spatial dimensions, and
- wherein the information regarding an induced electromagnetic field includes a plurality of amplitudes of the induced electromagnetic field, and
- wherein each among said plurality of amplitudes corresponds to one among a plurality of spatial locations, and
- wherein at least one among said plurality of spatial locations lies outside the boundaries of said grid.
Dependencies are inferred from the claim text.