Film adhesives containing maleimide compounds and methods for use thereof
AssigneeHenkel Corporation
InventorsPuwei Liu, Stephen M. Dershem, Kang Yang, Carolyn C. Albino
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Abstract
In accordance with the present invention, there are provided film adhesive compositions comprising at least one macromonomer having at least one unit of ethylenic unsaturation, at least one thermoplastic elastomer co-curable with the macromonomer, and at least one cure initiator, and methods for use thereof. Invention compositions are useful as adhesives in the microelectronics industry. In particular, invention film adhesives may be used to produce microelectronic assemblies with very thin bond lines without compromising adhesive strength.
Claims29
A thermally curable film adhesive composition comprising:
- a curable component comprising at least one macromonomer having at least one unit of ethylenic unsaturation, wherein said macromonomer is a maleimide,
- in the range of about 20-90 wt % of at least one thermoplastic elastomer co-curable with said at least one macromonomer, and
- at least one free-radical cure initiator,
- wherein wt % is based on total weight of the composition.
A thermally curable film adhesive composition comprising:
- in the range of about 5 wt % up to about 90 wt % thermoplastic elastomer co-curable with at least one unsaturated macromonomer,
- in the range of about 5 wt % up to about 90 wt % of a curable component comprising an unsaturated macromonomer, wherein said macromonomer is a maleimide,
- in the range of about 0.5 wt % up to about 2.0 wt % free-radical cure initiator,
- in the range of about 0.5 wt % up to about 5 wt % coupling agent, and
- in the range of about 1 wt % up to about 95 wt % filler, wherein wt % is based on total weight of the composition.
Dependencies are inferred from the claim text.