A component of semiconductor processing equipment, the component having a cerium oxide containing ceramic material forming an outermost surface of the component, the component being selected from the group consisting of a plasma chamber wall, a chamber liner, a gas distribution plate, a gas ring, a pedestal, a dielectric window, an electrostatic chuck, and a focus ring, and the cerium oxide containing ceramic material comprising one or more cerium oxides as the single largest constituent thereof, wherein the cerium oxide containing ceramic material is a ceramic layer on a ceramic substrate selected from the group consisting of alumina, silicon carbide, silicon nitride, boron carbide and boron nitride.