US 6,828,665 B2 · Module device of stacked semiconductor packages and method for fabricating the same

Abstract

A module device of stacked semiconductor packages and a method for fabricating the module device are proposed, wherein a first semiconductor package provided, and at least a second semiconductor package is stacked on and electrically connected to the first semiconductor package. The first semiconductor package includes a chip carrier for mounting at least a chip thereon; a circuit board positioned above and electrically connected to the chip carrier by a plurality of conductive elements; and an encapsulant for encapsulating the chip, conductive elements and encapsulant with a top surface of the circuit board being exposed, allowing the second semiconductor package to be electrically connected to the exposed top surface of the circuit board. As the circuit board is incorporated in the first semiconductor package by means of the encapsulant, it provides preferably reliability and workability for electrically connecting the second semiconductor package to the first semiconductor package.

Claims14

Dependent claims

A module device of stacked semiconductor packages, comprising:

a first semiconductor package;
and
at least a second semiconductor package stacked on and electrically connected to the first semiconductor package;
wherein the first semiconductor package comprises:
a chip carrier;
at least a chip mounted on the chip carrier;
a plurality of first conductive elements for electrically connecting the chip to the chip carrier;
a circuit board having a top surface and a bottom surface, and mounted above the chip;
a plurality of second conductive elements disposed on the bottom surface of the circuit board, for supporting and electrically connecting the circuit board to the chip carrier;
an encapsulant formed between the chip carrier and the circuit board, for encapsulating the chip and the first and second conductive elements, such that the encapsulant is flush with the top surface of the circuit board, allowing the top surface of the circuit board to be exposed to outside of the encapsulant and electrically connected with the second semiconductor package;
and
a plurality of third conductive elements for electrically connecting the first semiconductor package to an external device.

9 more elements

Dependencies are inferred from the claim text.

Module device of stacked semiconductor packages and method for fabricating the same

Life of this patent

Module device of stacked semiconductor packages and method for fabricating the same

Life of this patent

Abstract

Claims14