Ceramic electronic component and production method therefor
AssigneesNoritake Co., Limited, TDK Corporation
InventorsAtsushi Nagai, Minoru Sato
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AssigneesNoritake Co., Limited, TDK Corporation
InventorsAtsushi Nagai, Minoru Sato
Estimating the term…
A ceramic electronic component (20) having surface conductor films (23) and side-surface conductor films (24) excellent in burning shrinkage, bonding strength, solder heat resistance, solder wettability and the like. A method of producing a ceramic electronic component which uses a conductive paste containing as a main component Ag-based metal powder, the surface of the metal powder being coated with an organic metal compound or a metal oxide having as a constituting element any one selected from Al, Zr, Ti, Y, Ca, Mg and Zn, to form conductor films (23, 24 25) on a ceramic base material (21). A side-surface conductor film-forming paste differs form a surface conductor film-forming paste in that (1) the former paste has a relatively small coating amount of the organic metal compound or metal oxide and/or (2) contains either at least one kind of inorganic oxide powder as an accessory composition or a comparatively high percentage of the inorganic oxide powder.
A method for producing a ceramic electronic component comprising a ceramic base material, a surface film conductor formed on a surface of the base material, and a side film conductor formed on a surface adjacent to the surface, comprising:
A ceramic electronic component comprising:
Dependencies are inferred from the claim text.