System and method for testing multiple integrated circuits that are in the same package
AssigneeCypress Semiconductor Corporation
InventorsPaul D. Berndt, Jarie G. Bolander, Leah S. Clark
Life of this patent
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AssigneeCypress Semiconductor Corporation
InventorsPaul D. Berndt, Jarie G. Bolander, Leah S. Clark
Estimating the term…
In one embodiment, a test circuit is coupled to receive a first signal from a signal generator such as a test equipment. The test circuit allows access to one or more terminals of a first integrated circuit, a second integrated circuit, or both based at least on the signal. The test circuit may be in the first integrated circuit. The first integrated circuit and the second integrated circuit may be in a single package. In one embodiment, the test circuit routes signals to and from the second integrated circuit, thus allowing the second integrated circuit to be tested as if it was stand-alone. In one embodiment, the test circuit allows access to otherwise inaccessible terminals of the first integrated circuit, the second integrated circuit, or both.
A system for testing integrated circuits comprising:
A method of testing an integrated circuit comprising:
A multi-chip module comprising:
Dependencies are inferred from the claim text.