Laminated bus bar for use with a power conversion configuration

A three phase electronic converter assembly comprising:

• at least a first heat sink member having a mounting surface;
• first and second X phase converter bridge assemblies, each bridge assembly including a plurality of power switching devices, the first bridge assembly forming first through Xth external linkage terminals and the second bridge assembly forming (X+1)th through 2Xth external linkage terminals, each linkage terminal linkable to one phase of at least one of an X phase source and an X phase load, the switching devices mounted to the mounting surface of the at least first sink member;
• a plurality of capacitors;
• and
• a bus bar including a positive DC bus, a negative DC bus and a plurality of insulating layers that insulate the positive and negative DC buses and form an external insulating layer, the capacitors and each of the bridge assemblies linked to the positive and negative DC buses, the bar forming first and second external linking vias that open to the positive and negative DC buses, respectively.

A three phase electronic converter assembly comprising:

• a first heat sink member having a mounting surface;
• a second heat sink member having a mounting surface;
• first and second X phase converter bridge assemblies, each bridge assembly including a plurality of power switching devices, the first bridge assembly forming first through Xth external linkage terminals and the second bridge assembly forming (X+1)th through 2Xth external linkage terminals, each linkage terminal linkable to one phase of at least one of an X phase source and an X phase load, the first assembly switching devices mounted to the first sink member mounting surface and the second assembly switching devices mounted to the second sink member mounting surface;
• a plurality of capacitors;
• a bus bar including a positive DC bus, a negative DC bus and a plurality of insulating layers that insulate the positive and negative DC buses and form an external insulating layer, the capacitors and each of the bridge assemblies linked to the positive and negative DC buses, the external insulating layer forming first and second vias that open to the positive and negative DC buses, respectively.