Liquid metal switch and method of manufacture therefor
AssigneeAgilent Technologies, Inc.
InventorRonald Shane Fazzio
Life of this patent
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Abstract
A switch device and method for manufacturing the switch device in which substrates are provided collectively having defined therein a liquid metal switch and a sub-channel connected to the liquid metal switch. A cavity filled with sacrificial material is formed in a first one of the substrates. A heater element is formed at least in part over the sacrificial material and conductive vias are formed extending through one of the substrates to the heater element. The sacrificial material is removed and the substrates are joined with an adhesive seal.
Claims20
A method for manufacturing a switch device comprising:
- providing substrates collectively having defined therein a liquid metal switch and a sub-channel connected to the liquid metal switch;
- forming in a first one of the substrates a cavity filled with sacrificial material and connected to the sub-channel;
- forming a heater element at least in part over the sacrificial material;
- forming conductive vias extending through one of the substrates to the heater element;
- removing the sacrificial material;
- and
- joining the substrates with an adhesive seal.
A method for manufacturing a switch device comprising:
- providing substrates collectively having defined therein a liquid metal switch and a sub-channel connected to the liquid metal switch;
- forming in a first one of the substrates a cavity filled with sacrificial material and connected to the sub-channel;
- forming a heater element of a refractory nitride at least in part over the filler material;
- forming conductive vias extending through one of the substrates to the heater element;
- removing the sacrificial material;
- and
- joining the substrates with an adhesive seal.
A switch device comprising:
- substrates collectively having defined therein a liquid metal switch, a cavity and a sub-channel extending between the cavity and the liquid metal switch;
- a heater element spaced from the substrates in the cavity, the heater element comprising a refractory nitride, tungsten silicon nitride, tantalum nitride, platinum, or a combination thereof;
- conductive vias electrically connected to the heater element;
- and
- an adhesive seal joining the substrates.
Dependencies are inferred from the claim text.