US 6,821,407 B1 · Anode and anode chamber for copper electroplating

Abstract

An electroplating system includes (a) a phosphorized anode having an average grain size of at least about 50 micrometers and (b) plating apparatus that separates the anode from the cathode and prevents most particles generated at the anode from passing to the cathode. The separation may be accomplished by interposing a microporous chemical transport barrier between the anode and cathode. The relatively few particles that are generated at the large grain phosphorized copper anode are prevented from passing into the cathode (wafer) chamber area and thereby causing a defect in the part.

Claims25

Dependent claims

An apparatus for electroplating copper on a substrate, the apparatus comprising

(a) a cathode electrical connection that can connect to the substrate and apply a potential allowing the substrate to become a cathode;
(b) a copper anode having an average grain size of at least about 50 micrometers and comprising phosphorus in a concentration of at least about 200 ppm;
and
(c) a membrane separator defining an anode chamber, which membrane separator enables migration of ionic species, including metal ions, across the membrane separator while substantially preventing particles larger than about 0.05 micrometers from passing.

1 more element

Dependencies are inferred from the claim text.

Facts

Application

10/231,147Filed 27 Aug 2002 · continuation in part

Priority

10 May 2000

Granted

23 Nov 2004

Term ends

Not estimatedThe source records don’t support an estimate.

Classification8 codes

C25D 21/12
Processes for servicing or operating cells for electrolytic coating: process control or regulation
C25D 17/002
Constructional parts, or assemblies thereof, of cells for electrolytic coating: cell separation, e.g. membranes, diaphragms
C25D 17/12
Electrodes , e.g. composition, counter electrode: shape or form
C25F 7/00
Constructional parts, or assemblies thereof, of cells for electrolytic removal of material

Anode and anode chamber for copper electroplating

Life of this patent

Anode and anode chamber for copper electroplating

Life of this patent

Abstract

Claims25