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AssigneeSatCon Technology Corporation
InventorsDennis E. Hartzell, John Oleksy, Edward J. Ognibene, Lyle Breaux
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The present invention provides a heat exchange system for conducting heat away from high-power, heat-producing electronic components by conduction and convection. The heat exchange system comprises a metal tube that has been forged and drawn so as to define a flow channel for a cooling fluid, wherein the tube has an inner surface that comprises a plurality of integral fins that are structured and arranged to increase the available surface area of the inner surface of the metal tube exposed to the fluid and an outer surface that is in direct communication with the heat producing components. Coolant fluids are circulated through the flow channel, preferably, at turbulent flow conditions to minimize thermal resistance. The invention further provides a self-cooling, self-supporting electronic assembly that comprising one or more high-power electronic devices, the heat exchange systems, and an attaching system for attaching high-power electronic devices to the heat exchange system. The invention further provides a method of cooling a heat producing means comprising the steps of: providing a heat exchange system that is in direct communication with the heat-producing electronic components and circulating a fluid through the heat exchange system to conduct heat away from said heat exchange system and the heat producing electronic components.
A self-supporting heat exchange device for removing heat from one or more heat producing devices that are attachable to and supported structurally by the heat exchange device, said self-supporting heat exchange device comprising an integral, thick-walled tube of monolithic manufacture having an inner surface and an outer surface, wherein the outer surface is in direct thermal communication with the one or more heat-producing devices and the inner surface defines a flow channel for a cooling fluid, wherein said inner surface includes a plurality of integral fins that are structured and arranged about the flow channel to optimize heat transfer from said inner surface and said plurality of integral fins to the cooling fluid.
A self-cooling, self-supporting electronic assembly comprising:
A method of cooling one or more heat-producing assemblies, the method comprising the steps of:
Dependencies are inferred from the claim text.