Connector assembly for an implantable medical device and process for making

A process for making a connector assembly for use in an implantable medical device, comprising:

• forming a core element of a first thermoplastic material;
• positioning at least one circuit element adjacent to the core element and having a first portion extending within the core element and a second portion extending outward from the core element;
• and
• forming an overmold structure of a second thermoplastic material to extend over and adhere at least a portion of the core element and at least a portion of the at least one circuit element, the forming of the overmold structure including heating and injecting the second thermoplastic material to form the connector assembly to be electrically and mechanically coupled to the implantable medical device.

A process for making a circuit assembly for use in an implantable medical device, comprising:

• forming a core element of thermoplastic material;
• positioning at least one circuit element adjacent to the core element;
• and
• forming an overmold structure of thermoplastic material over at least a portion of the core element and at least a portion of the circuit element, wherein forming an overmold structure includes positioning the core element and the at least one circuit element in a mold, injecting thermoplastic material into the mold, and heating the core element prior to performing the injecting method.

A process for making a circuit assembly for use in an implantable medical device, comprising:

• forming a core element of thermoplastic material;
• positioning at least one circuit element adjacent to the core element;
• and
• forming an overmold structure of thermoplastic material over at least a portion of the core element and at least a portion of the circuit element, wherein forming a core element includes forming ridges on the surface of the core element, and forming an overmold structure includes melting at least one of the ridges on the surface of the core element.

A process for making a circuit assembly for use in an implantable medical device, comprising:

• forming a core element of thermoplastic material;
• positioning at least one circuit element adjacent to the core element;
• and
• forming an overmold structure of thermoplastic material over at least a portion of the core element and at least a portion of the circuit element, wherein forming an overmold structure includes positioning the core element and the at least one circuit element in a mold and injecting thermoplastic material into the mold, the mold including at least one coupling member to couple to the core element, and wherein forming an overmold structure includes coupling the at least one coupling member to the core element prior to performing the injecting method.

A process for making a circuit assembly for use in an implantable medical device, comprising:

• forming a core element of thermoplastic material;
• positioning at least one circuit element adjacent to the core element;
• and
• forming an overmold structure of thermoplastic material over at least a portion of the core element and at least a portion of the circuit element, wherein forming an overmold structure includes positioning the core element and the at least one circuit element in a mold and injecting thermoplastic material into the mold, the mold including at least one coupling member to couple to the at least one circuit element, and wherein forming an overmold structure includes coupling the at least one coupling member to the circuit element.