Technique for interconnecting multilayer circuit boards

A circuit module comprising:

• a first multilayer circuit board having a first plurality of electrically conductive vias of varying depths;
• a second multilayer circuit board having a second plurality of electrically conductive vias;
• and
• a circuit device having a first side mounted to a surface of the first multilayer circuit board and a second side mounted to a surface of the second multilayer circuit board, the circuit device comprising:
• a first plurality of pins of varying lengths located on the first side of the circuit device corresponding to the first plurality of electrically conductive vias of the first multilayer circuit board, each of the first plurality of pins extending into and in electrical contact with a respective one of the first plurality of electrically conductive vias of the first multilayer circuit board;
• and
• a second plurality of pins located on the second side of the circuit device corresponding to the second plurality of vias of the second multilayer circuit board, each of the second plurality of pins extending into and in electrical contact with a respective one of the second plurality of electrically conductive vias of the second multilayer circuit board;
• wherein each of the first plurality of pins of the circuit device has a length compatible with a depth of a respective one of the first plurality of electrically conductive vias of the first multilayer circuit board.

A method for interconnecting at least first and second multilayer circuit boards via a circuit device, the circuit device having a first plurality of pins located on a first surface of the circuit device and a second plurality of pins located on a second surface of the circuit device, the first multilayer circuit board having a first plurality of electrically conductive vias of varying depths and the second multilayer circuit board having a second plurality of electrically conductive vias, the method comprising the steps of:

• forming at least one of the first plurality of pins to have a length compatible with a depth of a respective one of the first plurality of electrically conductive vias of the first multilayer circuit board;
• joining the first surface of the circuit device to a surface of the first multilayer circuit board, each of the first plurality of pins extending into and being in electrical contact with a respective one of the first plurality of electrically conductive vias of the first multilayer circuit board;
• and
• joining the second surface of the circuit device to a surface of the second multilayer circuit board, each of the second plurality of pins extending into and being in electrical contact with a respective one of the second plurality of electrically conductive vias of the second multilayer circuit board.