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US 6,815,963 B2Granted
Probe for testing a device under test
AssigneeCascade Microtech, Inc.
InventorsK. Reed Gleason, Tim Lesher, Eric W. Strid, Mike Andrews, John Martin, John Dunklee, Leonard Hayden, Amr M. E. Safwat
Life of this patent
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Abstract
A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.
Claims51
A probe comprising:
- (a) a dielectric substrate;
- (b) an elongate conductor suitable to be electrically interconnected to a test signal supported by a first side of said substrate;
- (c) a conductive member suitable to be electrically interconnected to a ground signal supported by said second side of said substrate wherein said conductive member is under a majority of the length of said elongate conductor;
- (d) a conductive path between said first side of said substrate and said second side of said substrate and said conductive path free from electrical interconnection with said conductive member;
- (e) a contact electrically interconnected to said conductive path for testing a device under test;
- and
- (f) wherein said substrate has a thickness of less than 40 microns with a dielectric constant of less than 7.
4 more elements
A probe comprising:
- (a) a dielectric substrate supporting an elongate conductor on a first side of said substrate and a conductive member supported by said second side of said substrate wherein said conductive member is under a majority of the length of said elongate conductor;
- (b) a conductive path between said first side of said substrate and said second side of said substrate;
- (c) a contact electrically interconnected to said conductive path for testing a device under test;
- and
- (d) wherein said substrate has a thickness of less than 40 microns with a dielectric constant of less than 7.
2 more elements
A probe comprising:
- (a) a dielectric substrate supporting an elongate conductor on a first side of said substrate and a conductive member supported by said second side of said substrate;
- (b) a conductive path between said first side of said substrate and said second side of said substrate;
- (c) a contact electrically interconnected to said conductive path for testing a device under test;
- and
- (d) wherein said contact has a height relative to the adjoining surface of said dielectric substrate of less than 150 microns.
2 more elements
Dependencies are inferred from the claim text.