Method for transferring element, method for producing element, integrated circuit, circuit board, electro-optical device, IC card, and electronic appliance

A method for producing an element, comprising:

• forming a peeling layer in which the bonding force weakens under certain conditions on a forming substrate;
• forming an element layer including an element on the peeling layer;
• joining the element layer with a dissolvable bonding layer to a temporary transfer substrate;
• weakening the bonding force of the peeling layer to peel the element layer from the forming substrate, and moving the element layer to the temporary transfer substrate;
• applying resin directly onto a bottom side of the element layer which has been moved to the temporary transfer substrate, and curing the resin to form a sole resin substrate;
• and
• dissolving the bonding layer to peel the temporary transfer substrate from the resin substrate to produce the element.

A method for producing an integrated circuit, comprising:

• forming a peeling layer in which the bonding force weakens under certain conditions on a forming substrate;
• forming an integrated circuit layer including an integrated circuit on the peeling layer;
• joining the integrated circuit layer with a dissolvable bonding layer to a temporary transfer substrate;
• weakening the bonding force of the peeling layer to peel the integrated circuit layer from the forming substrate, and moving the integrated circuit layer to the temporary transfer substrate;
• applying resin directly onto a bottom side of the integrated circuit layer which has been moved to the temporary transfer substrate, and curing the resin to form a sole resin substrate;
• and
• dissolving the bonding layer to peel the temporary transfer substrate from the resin substrate to produce the integrated circuit.

A method for producing a circuit board, comprising:

• forming a peeling layer in which the bonding force weakens under certain conditions on a forming substrate;
• forming a circuit board layer including a circuit board on the peeling layer;
• joining the circuit board layer with a dissolvable bonding layer to a temporary transfer substrate;
• weakening the bonding force of the peeling layer to peel the circuit board layer from the forming substrate, and moving the circuit board layer to the temporary transfer substrate;
• applying resin directly onto a bottom side of the circuit board layer which has been moved to the temporary transfer substrate, and curing the resin to form a sole resin substrate;
• and
• dissolving the bonding layer to peel the temporary transfer substrate from the resin substrate to produce the circuit board.

A method for producing a circuit board, comprising:

• forming a peeling layer in which the bonding force weakens under certain conditions on a forming substrate;
• forming a circuit board comprising elements disposed in a plurality of two dimensionally disposed pixel electrodes on the peeling layer;
• joining the circuit board with a dissolvable bonding layer to a temporary transfer substrate;
• weakening the bonding force of the peeling layer to peel the circuit board from the forming substrate, and moving the circuit board to the temporary transfer substrate;
• applying resin directly onto a bottom side of the circuit board which has been moved to the temporary transfer substrate, and curing the resin to form a sole resin substrate;
• and
• dissolving the bonding layer to peel the temporary transfer substrate from the resin substrate.

A method for producing an IC card, comprising:

• forming a peeling layer in which the bonding force weakens under certain conditions on a forming substrate;
• forming an IC card layer including an IC card on the peeling layer;
• joining the IC card layer with a dissolvable bonding layer to a temporary transfer substrate;
• weakening the bonding force of the peeling layer to peel the IC card layer from the forming substrate, and moving the IC card layer to the temporary transfer substrate;
• applying resin directly onto a bottom side of the IC card layer which has been moved to the temporary transfer substrate, and curing the resin to form a sole resin substrate;
• and
• dissolving the bonding layer to peel the temporary transfer substrate from the resin substrate to produce the IC card.

A method for transferring an element, comprising:

• forming a peeling layer in which the bonding force weakens under certain conditions on an element-forming substrate for forming an element;
• forming an element layer including an element on the peeling layer;
• applying resin directly onto a top side of the element layer, and curing the resin to form a resin substrate;
• and
• weakening the bonding force of the peeling layer to peel the element-forming substrate from the element layer, and moving the element layer to the resin substrate to produce the element.

A method for producing an element, comprising:

• forming a peeling layer in which the bonding force weakens under certain conditions on a forming substrate;
• forming an element layer including an element on the peeling layer;
• applying resin directly onto a top side of the element layer, and curing the resin to form a resin substrate;
• and
• weakening the bonding force of the peeling layer to peel the fanning substrate from the element layer, and moving the element layer to the resin substrate to produce the element.

A method for producing an integrated circuit, comprising:

• forming a peeling layer in which the bonding force weakens under certain conditions on a forming substrate;
• forming an integrated circuit layer including an integrated circuit on the peeling layer;
• applying resin directly onto a top side of the integrated circuit layer, and curing the resin to form a resin substrate;
• and
• weakening the bonding force of the peeling layer to peel the forming substrate from the integrated circuit layer, and moving the integrated circuit layer to the resin substrate to produce the integrated circuit.

A method for producing a circuit board, comprising:

• forming a peeling layer in which the bonding force weakens under certain conditions on a forming substrate;
• forming a circuit board layer including a circuit board on the peeling layer;
• applying resin directly onto a top side of the circuit board layer, and curing the resin to form a resin substrate;
• and
• weakening the bonding force of the peeling layer to peel the forming substrate from the integrated circuit layer, and moving the integrated circuit layer to the resin substrate to produce the circuit board.

A method for producing a circuit board, comprising:

• forming a peeling layer in which the bonding force weakens under certain conditions on a forming substrate;
• forming a circuit board comprising elements disposed in a plurality of two dimensionally disposed pixel electrodes on the peeling layer;
• applying resin directly onto a top side of the circuit board, and curing the resin to form a resin substrate;
• and
• weakening the bonding force of the peeling layer to peel the forming substrate from the circuit board, and moving the circuit board to the resin substrate.

A method for producing an IC card, comprising:

• forming a peeling layer in which the bonding force weakens under certain conditions on a forming substrate;
• forming an IC card layer including an IC card on the peeling layer;
• applying resin directly onto a top side of the IC card layer, and curing the resin to form a resin substrate;
• and
• weakening the bonding force of the peeling layer to peel the forming substrate from the IC card layer, and moving the IC card layer to the resin substrate to produce the IC card.