Semiconductor wafer and vapor phase growth apparatus
AssigneeShin-Etsu Handotai Co., Ltd.
InventorHiroki Ose
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AssigneeShin-Etsu Handotai Co., Ltd.
InventorHiroki Ose
Estimating the term…
It is an object of the present invention to provide not only a semiconductor wafer obtained by forming a semiconductor thin film with uniform resistivity and substantially no slip dislocation on a main surface of a semiconductor single crystal substrate having a relatively low dopant concentration, as large as 300 mm or more in diameter but also a vapor phase growth apparatus by means of which such a semiconductor wafer can be produced. A dopant gas is supplied into a reaction chamber 10 through all of the inlet ports 18a to 18f disposed in a width direction of the reaction chamber 10 from a common gas pipe 22a functioning as a main dopant gas pipe. Further, the dopant gas is additionally supplied through inner inlet ports 18a and 18b, and middle inlet ports 18c and 18d, as specific gas inlet ports, into the reaction chamber 10 from first and second auxiliary dopant gas pipes 22b and 22c.
A vapor phase growth apparatus comprising a reaction chamber and a plurality of gas inlet ports disposed in a width direction of the reaction chamber, wherein a semiconductor raw material gas is supplied from the plurality of gas inlet ports onto a main surface of a semiconductor single crystal substrate rotating in the reaction chamber in one direction in almost parallel to the main surface thereof to grow a semiconductor thin film on the main surface thereof in vapor phase, characterized by that the vapor growth apparatus further comprises:
Dependencies are inferred from the claim text.