Electrostatic chucking device and manufacturing method thereof

An electrostatic chucking device manufacturing method including

• a step in which a polyimide film which constitutes a first insulation layer, a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm, a metal foil which constitutes an electrode layer, a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm and a polyimide film which constitutes a second insulation layer are sequentially superposed,
• a step in which a low-temperature compression bonding processing is performed at a heating temperature of 100 to 250° C. under pressure so as to form an electrostatic chucking sheet which is constituted by sequentially laminating the first insulation layer, the electrode layer and the second insulation layer,
• a step in which the electrostatic chucking sheet is superposed on a metal substrate by way of a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm, and
• a step in which a low-temperature compression bonding processing is performed at a heating temperature of 100 to 250° C. under pressure so as to form a laminated structure which is constituted by sequentially laminating the first insulation layer, the electrode layer and the second insulation layer on the metal substrate,
• wherein the polyimide films which constitute the first insulation layer and the second insulation layer have a film thickness of 20 to 50 μm.

An electrostatic chucking device manufacturing method including

• a step in which a polyimide film which constitutes a first insulation layer, a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm, a metal foil which constitutes an electrode layer, a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm and a polyimide film which constitutes a second insulation layer are sequentially superposed,
• a step in which a low-temperature compression bonding processing is performed at a heating temperature of 100 to 250° C. under pressure so as to form an electrostatic chucking sheet which is constituted by sequentially laminating the first insulation layer, the electrode layer and the second insulation layer,
• a step in which the electrostatic chucking sheet is superposed on a metal substrate by way of a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm, and
• a step in which a low-temperature compression bonding processing is performed at a heating temperature of 100 to 250° C. under pressure so as to form a laminated structure which is constituted by sequentially laminating the first insulation layer, the electrode layer and the second insulation layer on the metal substrate,
• wherein the low-temperature compression bonding processing is performed under the compression condition of 2 to 5 MPa in the thicknesswise direction in the atmosphere.

An electrostatic chucking device manufacturing method including

• a step in which a polyimide film which constitutes a first insulation layer, a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm, a metal foil which constitutes an electrode layer, a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm and a polyimide film which constitutes a second insulation layer are sequentially superposed,
• a step in which a low-temperature compression bonding processing is performed at a heating temperature of 100 to 250° C. under pressure so as to form an electrostatic chucking sheet which is constituted by sequentially laminating the first insulation layer, the electrode aver and the second insulation layer,
• a step in which the electrostatic chucking sheet is superposed on a metal substrate by way of a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm, and
• a step in which a low-temperature compression bonding processing is performed at a heating temperature of 100 to 250° C. under pressure so as to form a laminated structure which is constituted by sequentially laminating the first insulation layer, the electrode layer and the second insulation layer on the metal substrate,
• wherein the low-temperature compression bonding processing is performed under the compression condition of 0.1 to 5 MPa in the thicknesswise direction in the reduced-pressure atmosphere of not more than 133 Pa.

An electrostatic chucking device manufacturing method including

• a step in which a polyimide film which constitutes a first insulation layer, a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm, a metal foil which constitutes an electrode layer, a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm and a polyimide film which constitutes a second insulation layer are sequentially superposed,
• a step in which a low-temperature compression bonding processing is performed at a heating temperature of 100 to 250° C. under pressure so as to form an electrostatic chucking sheet which is constituted by sequentially laminating the first insulation layer, the electrode layer and the second insulation layer,
• a step in which the electrostatic chucking sheet is superposed on a metal substrate by way of a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm, and
• a step in which a low-temperature compression bonding processing is performed at a heating temperature of 100 to 250° C. under pressure so as to form a laminated structure which is constituted by sequentially laminating the first insulation layer, the electrode layer and the second insulation layer on the metal substrate,
• wherein the polyimide films of the first and second insulation layers have a film thickness in a range of 20 μm and less than 50 μm.