# US 6,809,367 B2 · Device for interconnecting, in three dimensions, electronic components

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- Number: US 6,809,367 B2
- Document ID: US6809367B2
- Status: Granted
- Kind: B2
- Application number: 10/149,789
- Filed: 2002-06-17
- Published: 2002-12-19
- Granted: 2004-10-26
- Earliest claimed: 1999-12-15
- Assignees: 3D Plus
- Inventors: Christian Val
- Web page: https://patentgrep.com/patent/US6809367B2

## CPC

- H10W 90/00: Package configurations
- H05K 1/185: associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
- H05K 3/403: {Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof (H05K3/4092 takes precedence)}
- H10W 20/495: {Capacitive arrangements or effects of, or between wiring layers}
- H10W 72/0198: {batch processes}
- H05K 1/0218: {by printed shielding conductors, ground planes or power plane (H05K1/0236 takes precedence)}
- H05K 1/0231: {Capacitors or dielectric substances}
- H05K 1/184: associated with components inserted in holes through the PCBs and wherein terminals of the components are connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
- H05K 3/045: {by making a conductive layer having a relief pattern, followed by abrading of the raised portions}
- H05K 2201/0715: provided by an outer layer of PCB
- H05K 2201/09181: Notches in edge pads
- H05K 2201/09645: Patterning on via walls; Plural lands around one hole
- H05K 2201/10643: Disc shaped leadless component
- Y10T 29/49146: with encapsulating, e.g., potting, etc.
- Y10T 29/49165: by forming conductive walled aperture in base
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

The invention relates to a device for interconnecting, in three dimensions, electronic components. In order to decrease the parasitic capacitances between the connections and shielding of the device, metallized grooves are cut in the block of stacked circuits, just clipping the connection to conductors of which are set back from the corresponding face of the block. The assembly is then encapsulated with resin and shielded by metallization. The invention is especially applicable to producing electronic systems in three dimensions with a small size.

## Claims

### Claim 1

An electronic device for interconnection in three dimensions comprising:
packages or circuits containing at least one electronic component and fitted with connection conductors, in which said packages or circuits are stacked and encapsulated with an electrically insulating material to form a block having substantially planar surfaces, opposing faces of the block coming in contact with opposite ends of said conductors,
wherein the opposite ends of said conductors are set back from said opposing faces of the block,
wherein said faces comprise grooves having enough depth to just clip respective ends of said conductors and the faces of which are metallized, and
wherein said block comprises an electrically insulating material encapsulating all of the block and grooves.

### Claim 2 (depends on 1)

The device as claimed in claim 1, wherein said block further comprises a metallic shielding layer covering the electrically insulating material encapsulating an assembly of the block and conductors.

### Claim 3 (depends on 1)

The device as claimed in claim 1, wherein at least one predetermined of the grooves just clip ends of two adjacent conductors, and wherein the metallization of a bottom of said at least one predetermined groove is interrupted over an entire length of said grooves.

### Claim 4 (depends on 3)

The device as claimed in claim 3, wherein, between lateral faces of said at least one predetermined groove, a capacitor is fastened to the lateral faces by an electrically conducting material.

### Claim 5 (depends on 1)

The device as claimed in claim 1, wherein a cross section of said grooves is one of trapezoidal, and partly circular.

### Claim 6 (depends on 1)

The device as claimed in claim 1, wherein said grooves are first grooves having a width W and bottom surfaces, and said device further comprises second grooves disposed in said bottom surfaces and having a width smaller than W.