Methods in electroanalytical techniques to analyze organic components in plating baths
AssigneeApplied Materials, Inc.
InventorsZhi-wen Sun, Chunman Yu, Brian Metzger, David W. Nguyen, Girish Dixit
Life of this patent
Estimating the term…
Loading patent…
AssigneeApplied Materials, Inc.
InventorsZhi-wen Sun, Chunman Yu, Brian Metzger, David W. Nguyen, Girish Dixit
Estimating the term…
Embodiments of the invention provide an electro-analytical method for determining the concentration of an organic additive in an acidic or basic metal plating bath using an organic chemical analyzer. The method includes preparing a supporting-electrolyte solution, preparing a testing solution including the supporting-electrolyte solution and a standard solution, measuring an electrochemical response of the supporting-electrolyte solution using the organic chemical analyzer, and implementing an electro-analytical technique to determine the concentration of the organic additive in the plating bath from the electrochemical response measurements. The method is performed for independently analyzing one organic additive component in a plating bath containing multi-component organic additives, regardless of knowledge of the concentration of other organic additives and with minimal interference among organic additives.
An electro-analytical method for determining the concentration of an organic additive of interest in a plating bath, having an unknown conformation including the organic additive and a suppressing agent to affect the quality of a metal to be plated, using an organic chemical analyzer operating on the basis of an electro-analytical principle, comprising:
An electro-analytical method for determining the concentration of an organic additive of interest, affecting the quality of a metal to be plated in a plating bath, using an organic chemical analyzer operating on the basis of an electro-analytical principle, comprising:
An electro-analytical method for determining the concentration of an organic additive of interest in a plating bath, affecting the quality of a metal to be plated, using an organic chemical analyzer operating on the basis of an electro-analytical principle, comprising
An electro-analytical method for determining the concentration of an organic additive of interest selected from the group consisting of accelerator, brightener, and anti-suppressor, independently of knowledge of the concentration of a suppressing agent selected from the group consisiting of suppressor, carrier, surfactant, wetting agent, leveler, over-plate inhibitor, grain refiner, and combinations thereof with minimal interference among organic additives in a plating bath using an organic chemical analyzer, comprising:
An electro-analytical method for determining the concentration of an organic additive of interest selected from the group consisting of suppressor, carrier, surfactant, and wetting agent, independently of knowledge of the concentration of an anti-suppressing agent selected from the group consisting of accelerator, brightener, anti-suppressor, leveler, over-plate inhibitor, grain refiner, and combinations thereof with minimal interference among organic additives in a plating bath using an organic chemical analyzer, comprising:
An electro-analytical method for determining the concentration of an organic additive of interest selected from the group consisting of leveler, over-plate inhibitor, and grain refiner in a plating bath, independently of knowledge of the concentrations of any other suppressing and anti-suppressing agents from the plating bath with minimal interference among organic additives using an organic chemical analyzer, comprising:
A method for analyzing an electrolyte in a electro-chemical deposition system having one or more process cells in communication with a main electrolyte supply tank, comprising:
A method for analyzing an electrolyte in a electro-chemical deposition system having one or more process cells in communication with a main electrolyte supply tank, comprising:
A method for analyzing an electrolyte in a electrochemical deposition system having one or more process cells in communication with a main electrolyte supply tank, comprising:
An electrochemical deposition system, comprising:
An electrochemical deposition system, comprising:
An electro-chemical deposition system, comprising:
Dependencies are inferred from the claim text.