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US 6,807,065 B2Granted
Multilayer printed circuit board
AssigneeSumitomo Electric Industries, Ltd.
InventorMasahiro Sato
Life of this patent
Estimating the term…
Abstract
A multilayer PCB has first and second signal transmission lines and first and second ground layers. A signal via is connected between the first and second transmission lines. Ground vias extending parallel to the signal via are connected between the first and second ground layers. The end of the first ground layer protrudes with respect to the second ground layer and extends nearer to the signal via than the second ground layer. Thus, it is possible to stabilize the characteristic impedance of the first transmission line.
Claims7
A multilayer printed circuit board (PCB), comprising:
- a first signal transmission line;
- a second signal transmission line opposite to the first transmission line;
- a first ground layer opposite to the first transmission line;
- a second ground layer opposite to the first ground layer;
- a first insulator disposed between the first and second transmission lines;
- a second insulator disposed between the first and second ground layers;
- a signal via passing through the first insulator and connected between the first and second transmission lines, the signal via being separated from the first and second ground layers;
- and
- a ground via passing through the second insulator and connected between the first and second ground layers, the ground via being separated from the signal via,
- wherein the first ground layer has an end protruding with respect to the second layer, the end extending nearer to the signal via than an end of the second ground layer opposite to the end.
7 more elements
Dependencies are inferred from the claim text.