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US 6,807,064 B2Granted
Electronic component with at least one semiconductor chip and method for producing the electronic component
AssigneeInfineon Technologies AG
InventorsHarry Hedler, Thorsten Meyer
Life of this patent
Estimating the term…
Abstract
An electronic component having at least one semiconductor chip, a rewiring layer connected to the semiconductor chip, and a printed circuit board associated with the rewiring layer. The rewiring layer is provided with flexible contacts that correspond with contact faces of the printed circuit board, and the rewiring layer is solidly connected to the printed circuit board via a flat intermediate layer. A method for producing the electronic component is described.
Claims24
An electronic component, comprising:
- at least one semiconductor chip;
- a rewiring layer connected to said semiconductor chip and having a surface remote from said semiconductor chip;
- a printed circuit board associated with said rewiring layer;
- contact faces disposed on said printed circuit board;
- flexible contacts disposed on said surface of said rewiring layer remote from said semiconductor chip, said flexible contacts corresponding with said contact faces on said printed circuit board;
- and
- a flat intermediate layer solidly connecting said rewiring layer to said printed circuit board;
- said flexible contacts formed on said rewiring layer being subject to pre-stressing, said flexible contacts protruding slightly past flat intermediate layer between said rewiring layer and said printed circuit board when in an unstressed state.
5 more elements
A method for producing electronic components, which comprises the steps of:
- furnishing a semiconductor water having semiconductor chips disposed in rows and columns and saw-scoring regions provided between said semiconductor chips;
- applying rewiring layers, one each, to active front sides of each of the semiconductor chips;
- applying flexible contacts to surfaces of the rewiring layers remote from the active front sides of the semiconductor chips;
- applying a flat intermediate layer to sides of the rewiring layers remote from the semiconductor chips;
- and
- bonding the rewiring layers to printed circuit boards having contact faces aligned with the flexible contacts;
- said flexible contacts formed on said rewiring layer being subject to pre-stressing, said flexible contacts protruding slightly past said intermediate layer between said rewiring layer and said printed circuit board when in an unstressed state.
4 more elements
Dependencies are inferred from the claim text.