High-frequency integrated circuit module

A high-frequency integrated circuit (IC) module comprising:

• a primary multilayer mounting board on which an IC with a plurality of high-frequency signal terminals on one side portion thereof is mounted;
• a plurality of IC connecting portions disposed on one surface of said primary multilayer mounting board on which said IC is mounted, said IC connecting portions being respectively connected with said plurality of high-frequency signal terminals of said IC;
• a plurality of external connection terminal portions disposed on a side portion of the other surface of said primary multilayer mounting board which portion corresponds to said one side portion of said integrated circuit, at wider intervals than those between the high-frequency signal terminals of said IC;
• a plurality of high-frequency signal lines provided on the other surface of said primary multilayer mounting board and respectively connected at their outer ends with said external connection terminal portions;
• a plurality of first through holes for respectively connecting the inner ends of said high-frequency signal lines with said IC connecting portions;
• a secondary multilayer mounting board connected with the other surface of said primary multilayer mounting board through bumps;
• and
• a high-frequency restricting member for ground-connecting positions between said high-frequency signal lines with the one surface of said primary multilayer mounting board and restricting propagation of high-frequency signals, provided at least along said high-frequency signal lines.