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US 6,806,789 B2Granted
Quadrature hybrid and improved vector modulator in a chip scale package using same
AssigneeM/A-Com, Inc.
InventorsShawn Peter Bawell, Simon Donald Gay, Christopher Dirk Weigand
Life of this patent
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Abstract
In accordance with the present invention, a quadrature hybrid circuit is provided comprising a first spiral inductor and a second spiral inductor separated by an insulating layer to provide all necessary capacitances intrinsically. Further, a vector modulator circuit is provided that incorporates a plurality of quadrature hybrid circuits on a MMIC contained within a chip scale package.
Claims18
A circuit functioning as a quadrature hybrid comprising;
- a first spiral inductor and a second spiral inductor;
- a first output and a second output,
- an insulating layer disposed between said first spiral inductor and said second spiral inductor, wherein said first spiral inductor and said second spiral inductor and said insulating layer are positioned relative to each other to create an intrinsic capacitance, said intrinsic capacitance selected in relation to said first and second inductors to cause said second output to be approximately ninety degrees different in phase to said first output.
A circuit for performing vector modulation, said circuit encapsulated within a chip scale package, comprising:
- an MMIC, said MMIC comprising:
- an input quadrature hybrid;
- an output power combiner;
- a first quadrature hybrid and a second quadrature hybrid, wherein said first and said second hybrids each comprise:
- a first spiral inductor and a second spiral inductor;
- an insulating layer disposed between said first spiral inductor and said
- second spiral inductor, wherein said first spiral inductor and said
- second spiral inductor and said insulating layer are positioned relative
- to each other to create an intrinsic capacitance;
- and
- a plurality of terminating elements.
8 more elements
Dependencies are inferred from the claim text.