Method and apparatus for processing an array of packaged semiconductor devices
AssigneeASM Assembly Automation Ltd.
InventorsChing Man Stanley Tsui, M. Bilan Curito, Jr., Lap Kei Eric Chow
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Abstract
The invention provides a method and apparatus for processing an array of electronic components. It involves providing mounting means to mount unsingulated components onto the mounting means, singulating the components to physically separate them, and testing the singulated electronic components for defects whilst they are mounted on the mounting means, and without removal therefrom.
Claims24
A method of processing an unsingulated array of packaged semiconductor devices comprising the steps of:
- mounting the singulated array of packaged semiconductor devices on a mounting device;
- then singulating the packaged semiconductor devices to physically separate the packages;
- and then
- testing the singulated packaged semiconductor devices for defects while they are mounted on the mounting device and without removal therefrom.
An apparatus for processing an unsingulated array of packaged semiconductor devices comprising:
- a mounting device for mounting the unsingulated array of packaged semiconductor devices;
- a singulating device for singulating the array of packaged semiconductor devices;
- and
- a testing device operative to test each of the singulated packaged semiconductor devices for defects;
- whereby singulation and testing of the singulated packaged semiconductor devices are conducted while they are mounted on the mounting device without removal therefrom.
Dependencies are inferred from the claim text.