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US 6,806,583 B2Granted
Light source
AssigneeAgilent Technologies, Inc.
InventorsHuck Khim Koay, Seong Choon Lim, Cheng Why Tan, Gurbir Singh A/L Balwant Singh, Chee Keong Chong, Sundar a/l Natarajan Yoganandan
Life of this patent
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Abstract
A light source suitable for surface mounting onto a printed circuit board. The light source includes a planar substrate with a centrally positioned recess. A light emitting diode is mounted in the recess and the substrate is encapsulated by a transparent encapsulant material forming an ellipsoidal dome over the light emitting diode.
Claims2
A light source comprising:
- a planar substrate having an upper surface and a lower surface, a portion of the upper surface defining a recess having a side wall tapering outwards towards the upper surface, the substrate defining first and second vias extending between the upper and lower surfaces,
- a light emitting diode mounted in the recess of the substrate adjacent the side walls,
- a first electrically-conductive interconnect extending between the upper and lower surfaces, the first interconnect having a terminal on the upper surface coupled to the light emitting diode and an exposed pad on the lower surface for coupling to external circuitry,
- a second electrically-conductive interconnect extending between the upper and lower surfaces, the second interconnect having a terminal on the upper surface coupled to the light emitting diode and a conductive pad on the lower surface for coupling to external circuitry, a portion of each of the first and second interconnects extending through the first and second vias respectively, and
- a transparent encapsulated material bonded to the first surface of the substrate to encapsulate the light emitting diode, the material being molded to form an ellipsoidal dome over the light emitting diode.
2 more elements
A light source comprising:
- a planar substrate having an upper surface and a lower surface, a portion of the upper surface defining a recess having a side wall tapering outwards towards the upper surface,
- a light emitting diode mounted in the recess of the substrate adjacent the side walls,
- a first electrically-conductive interconnect extending between the upper and lower surfaces, the first interconnect having a terminal on the upper surface coupled to the light emitting diode and exposed pad on the lower surface for coupling to external circuitry,
- a second electrically-conductive interconnect extending between the upper and lower surface, the second interconnect having a terminal on the upper surface coupled to the light emitting diode and a conductive pad on the lower surface for coupling to external circuitry, and
- a transparent encapsulate material bonded to the first surface of the substrate to encapsulate the light emitting diode the material being molded to form an ellipsoidal dome over the light emitting diode, the ellipsoidal dome having a major axis equal to the length of the planar substrate and a minor axis equal to the width of the substrate.
2 more elements
Dependencies are inferred from the claim text.