Bonded anisotropic conductive film
AssigneeAu Optronics Corporation
InventorKuan-Sheng Hsieh
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Abstract
A bonded anisotropic conductive film fabricated using a plastic material and a plurality of conductive particles inside the plastic material. The plastic material is a thermal set material hardening after being raised to a first temperature. Each conductive particle inside the plastic material includes a conductive bead, a bonding layer and a flux layer. The bonding layer is formed over the conductive bead enclosing the conductive bead entirely. The flux layer is formed over the bonding layer. The bonding layer has a melting point at a second temperature where the second temperature is higher than the first temperature.
Claims10
A bonded anisotropic conductive film, comprising:
- a resin material;
- and
- a plurality of conductive particles dispersed in the resin material, wherein one or more conductive particles comprises a conductive bead including gold is encapsulated in a solder material covered with an outermost flux layer.
A bonded anisotropic conductive film, comprising:
- a plastic material;
- and
- a plurality of conductive particles within the plastic material, wherein each conductive particle has a conductive bead including gold, a bonding layer encapsulating the conductive bead and an insulating layer covering the bonding layer forming an outermost covering layer of the conductive bead, wherein the bonding layer is comprised of a lead-tin alloy.
A flip chip package having a bonded anisotropic conductive film structure in any one of the claims from 4 to 6, comprising:
- a silicon chip, a carrier and a bonded anisotropic conductive film, wherein the silicon chip has a plurality of first contact points thereon and the carrier has a plurality of contact points thereon that correspond in position to the first contact points, the bonded anisotropic conductive film is inserted between the silicon chip and the carrier such that each pair of corresponding first contact point and second contact point form a common metallic bond through the bonding layer of conductive particles within the bonded anisotropic conductive film.
A bonded anisotropic conductive film, comprising:
- a plastic material;
- and
- a plurality of conductive particles within the plastic material, wherein each conductive particle has a gold bead, wherein one or more conductive particles are encapsulated by a bonding layer and an insulating layer covers the bonding layer forming an outermost covering layer, wherein the bonding layer is comprised of a lead-tin alloy.
Dependencies are inferred from the claim text.