Back to results
US 6,806,580 B2Granted
Multichip module including substrate with an array of interconnect structures
AssigneeFairchild Semiconductor Corporation
InventorsRajeev Joshi, Maria Cristina B. Estacio
Life of this patent
Estimating the term…
Abstract
A multichip module is disclosed. In one embodiment, the multichip module includes a substrate having a first side and a second side, the first side being opposite to the first side. A driver chip is at the first side of the substrate. A semiconductor die comprising a vertical transistor is at the second side of the substrate. The driver chip and the semiconductor die are in electrical communication through the substrate.
Claims18
A multichip module comprising:
- (a) a substrate having a first side and a second side, the second side being opposite the first side;
- (b) a chip at the first side of the substrate;
- (c) a semiconductor die comprising a vertical transistor at the second side, wherein the chip and the semiconductor die are in electrical communication through the substrate;
- and
- (d) an array of solder interconnect structures at the second side of the substrate.
2 more elements
A multichip module comprising:
- (a) a ceramic substrate having a first side and a second side, the first side being opposite the first side;
- (b) a driver chip at the first side of the substrate;
- (c) a first semiconductor die comprising a first vertical transistor at the second side, wherein the driver chip and the first semiconductor die are in electrical communication through the ceramic substrate;
- (d) a second semiconductor die comprising a second vertical transistor at the second side, wherein the driver chip and the second semiconductor die are in electrical communication through the ceramic substrate;
- and
- (e) an array of solder interconnect structures disposed around the first and second semiconductor dies.
3 more elements
Dependencies are inferred from the claim text.