Subresolution features for a semiconductor device
AssigneeMicron Technology, Inc.
InventorPhilip J. Ireland
Life of this patent
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Abstract
An integrated circuit having at least one electrical interconnect for connecting at least two components and a process for forming the same are disclosed. At least two opposing contoured, merging dielectric surfaces define at least one elongated passageway which has at least one. A conductive material then substantially fills the at least one opening and at least one elongated passageway to form at least one electrical interconnect guided by the at least one elongated passageway and extended through the layer of dielectric material along the length to electrically connect at least two of the components of the integrated circuit.
Claims20
An integrated circuit having at least two separated regions comprising:
- a semiconductor substrate having a surface;
- a plurality of substantially parallel conductive strips disposed on said substrate surface, each conductive strip of said plurality of substantially parallel conductive strips having a length;
- a layer of dielectric material deposited on a portion of said substrate surface and around said plurality of substantially parallel conductive strips, said layer of dielectric material forming at least one set of contoured dielectric surfaces overhanging said substrate surface at a location between at least two of said plurality of substantially parallel conductive strips to define an elongated passageway located therein, said elongated passageway being substantially enclosed within said layer of dielectric material along said length of each of said plurality of substantially parallel conductive strips in a direction substantially parallel to said plurality of substantially parallel conductive strips, said elongated passageway having at least one opening leading thereinto, said layer of dielectric material including a glass material;
- a conductive material substantially filling said elongated passageway through said at least one opening;
- and
- at least one electrical interconnect formed between said at least two separated regions of said integrated circuit by said conductive material substantially filling said elongated passageway through said at least one opening.
A system for forming interlevel electrical interconnections in an integrated circuit having at least two regions, said system comprising:
- at least two adjacent conductive strips located on a surface of a substrate, said at least two adjacent conductive strips having a length;
- a layer of glass deposited on at least a portion of said at least two adjacent conductive strips and deposited on at least a portion of said surface of said substrate located between said at least two adjacent conductive strips, said layer of glass overlaying said at least a portion of said surface of said substrate forming at least one elongated passageway, said at least one elongated passageway having at least one opening extending along at least a portion of said length of each of said at least two adjacent conductive strips and through at least a portion of said layer of glass;
- and
- a conductive material substantially deposited within said at least one elongated passageway through said at least one opening along said at least a portion of said length, said conductive material substantially filling said at least a portion of said length and enclosed within at least a portion of said at least one elongated passageway for connecting said at least two regions.
An integrated circuit comprising:
- a semiconductor substrate;
- a plurality of conductive strips connected to said semiconductor substrate, each conductive strip having a length;
- at least one glass layer covering said plurality of conductive strips, said at least one glass layer having a portion thereof located on a surface of said semiconductor substrate between at least two conductive strips of said plurality of conductive strips and forming at least one elongated passage having a portion thereof extending substantially along at least a portion of said length of said at least two conductive strips;
- and
- at least one elongated conductor having at least a portion thereof disposed within at least a portion of said at least one elongated passage and substantially filling said at least a portion of said at least one elongated passage.
Dependencies are inferred from the claim text.