Decoupling capacitor for integrated circuit package and electrical components using the decoupling capacitor and associated methods
AssigneeBoard of Trustees of the University of Arkansas
InventorLeonard W. Schaper
Life of this patent
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Abstract
A capacitive structure is made with thin film capacitor plates substantially surrounding an opening cavity for accommodating a chip. The capacitive structure includes at least one capacitor and is mounted around the periphery of a ball grid array (BGA) having a flip chip in the opening. The capacitive structure provides a high capacitance with a low parasitic inductance.
Claims17
An electrical component including a thin-film capacitive structure comprising a pair of conductive films separated by a dielectric film, wherein the capacitive structure is a substantially flat annulus and the conductive films have electrical connection elements disposed adjacent to a central opening of the annulus in the thickness direction of the substantially flat capacitive structure.
An electrical component comprising a substrate with a chip area and a remainder area surrounding the chip area, and wherein a thin-film, substantially flat capacitive structure is adhered to the remainder area, surrounds the chip area, and has electrical connector elements that provide conductive paths from the capacitive structure to electrical connection points on the substrate, said paths being disposed in the thickness direction of the capacitive structure and the substrate.
Dependencies are inferred from the claim text.