Semiconductor apparatus with decoupling capacitor
AssigneeOki Electric Industry Co., Ltd.
InventorsMakoto Terui, Noritaka Anzai
Life of this patent
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Abstract
A lead frame type of semiconductor apparatus includes a die pad on which a semiconductor chip is mounted; ground terminals which are to be grounded; power supply terminals which are connected to a power supply; inner leads connected to the ground terminals and power supply terminals, in which a pair of adjacent inner leads for power supply terminal and ground terminal are extended inwardly; a chip capacitor mounting pad which is provided at inner ends of the extended inner leads; and a chip capacitor which is mounted on the chip capacitor mounting pad so that a decoupling capacitor is provided.
Claims5
A semiconductor apparatus comprising:
- an organic material substrate;
- a die pad formed on the organic material substrate, a semiconductor chip being mounted on the die pad;
- ground terminals which are to be grounded;
- power supply terminals which are supplied with electrical power;
- first conductive patterns which are formed on the organic material substrate and are connected to the ground terminals;
- second conductive patterns which are formed on the organic material substrate and are connected to the power supply terminals, in which adjacent two of the first and second conducive patterns are extended inwardly;
- chip capacitor mounting pads which are provided at inner ends of the extended first and second conductive patterns;
- and
- chip capacitors which are mounted on the chip capacitor mounting pads so that a decoupling capacitor is provided.
Dependencies are inferred from the claim text.