Electronic apparatus
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorAkihiro Kondoh
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Abstract
An electronic apparatus of the present invention comprises an electronic circuit board; an electrically conductive casing for encasing the electronic circuit board; a semiconductor element module electrically connected to the electronic circuit board; and a resin fixture intervening between the electrically conductive casing and the semiconductor element module, the resin fixture mounted with the semiconductor element module and fitted to the electrically conductive casing. As a result, the resin fixture can suppress a transfer of heat generated in the electronic circuit board to the semiconductor element module.
Claims13
An electronic apparatus comprising:
- an electronic circuit board;
- an electrically conductive casing for encasing said electronic circuit board;
- a semiconductor element module having lead terminals electrically connected to said electronic circuit board, said semiconductor element module having a column-shaped section, an axis of said column-shaped section being parallel to a direction of extension of said lead terminals;
- and
- a resin fixture intervening between said electrically conductive casing and said semiconductor element module, said resin fixture mounted with said semiconductor element module, said resin fixture having a cylinder-shaped section for retaining, in its inner periphery, said column-shaped section of said semiconductor element module, a surface of an outer periphery and end of said cylinder-shaped section being plated and a surface of said inner periphery of said cylinder-shaped section not being plated, and
- said resin fixture, on another side of said cylinder-shaped section, directly fitted to said electrically conductive casing.
An electronic apparatus comprising:
- an electronic circuit board;
- an electrically conductive casing for encasing said electronic circuit board;
- a coaxial optical semiconductor element module electrically connected to said electronic circuit board via a plurality of lead terminals, said semiconductor element module having a column-shaped section, an axis of said column-shaped being parallel to a direction of extension of said lead terminals;
- and
- a resin fixture intervening between said electrically conductive casing and said semiconductor element module, said resin fixture mounted with said semiconductor element module and fitted to said electrically conductive casing, said resin fixture having an opening having an inner diameter which is larger than an outer diameter of said column-shaped section of said semiconductor element module, said opening retaining said column-shaped section therein, an outer periphery surface of said resin fixture being metal plated and an inside surface of said opening not being metal plated.
Dependencies are inferred from the claim text.