Method and apparatus for connecting vertically stacked integrated circuit chips

A method comprising:

• providing a plurality of prepackaged integrated circuits, each with a first plurality of exterior leads connected to a second plurality of interior wires, having at least one exterior lead which is not connected to any interior wire,
• vertically stacking said plurality of prepackaged integrated circuits are on each other so that like leads are aligned with each;
• modifying said prepackaged integrated circuits so that said first plurality of exterior leads are removed exposing ends of said second plurality of interior wires on a collective lateral surface of said vertically stacked prepackaged integrated circuits;
• and
• disposing a plurality of metallizations on said collective lateral surface to connect selected ones of said second plurality of interior wires together and separately connect selected other ones of second plurality of interior wires.

An apparatus comprising:

• a plurality of prepackaged circuit means for performing an electrical function, each with a first plurality of exterior lead means for providing exterior electrical connection to said circuit means, said exterior lead means connected to a second plurality of interior wire means for connecting said exterior lead means to a circuit in said prepackaged circuit means, having at least one exterior lead means which is not connected to any interior wire means,
• wherein said plurality of prepackaged circuit means are vertically stacked on each other so that like exterior lead means are aligned with each, said prepackaged circuit means being modified so that said first plurality of exterior lead means are removed exposing ends of said second plurality of interior wire means on a collective lateral surface of said vertically stacked prepackaged circuit means;
• and
• a plurality of metallization means disposed on said collective lateral surface for connecting selected ones of said second plurality of interior wire means together and separately connecting to selected other ones of second plurality of interior wire means.

A method comprising the steps of:

• providing a plurality of prepackaged integrated circuits, each with a first plurality of exterior leads connected to a second plurality of interior wires, having at least one exterior lead which is not connected to any interior wire,
• vertically stacking said plurality of prepackaged integrated circuits are on each other so that like leads are aligned with each;
• modifying said prepackaged integrated circuits so that said first plurality of exterior leads are removed exposing ends of said second plurality of interior wires on a collective lateral surface of said vertically stacked prepackaged integrated circuits;
• and
• disposing a plurality of metallizations on said collective lateral surface to connect selected ones of said second plurality of interior wires together and separately connect selected other ones of second plurality of interior wires.