Semiconductor wafer, method of manufacturing semiconductor wafer having bumps, semiconductor chip having bumps and method of manufacturing the same, semiconductor device, circuit board, and electronic equipment

A semiconductor wafer comprising:

• a plurality of monolithic integrated circuits formed in a semiconductor crystal for realizing a function of a plurality of semiconductor chips;
• a plurality of pads formed in a plurality of first regions to be the plurality of semiconductor chips;
• and
• a conductive film formed on the pads semiconductor wafer through a second region, which is located between two of the first regions, and electrically connecting at least two of the pads,
• wherein the conductive film has a first part and a plurality of second parts,
• wherein the first part is formed along and inside the second region so as to enclose each of the first regions, and
• wherein each of the second parts electrically connects a pair of the pads adjacent to each other across the second region, the second parts electrically connected with the first part, a part of each of the second parts formed on the pads.