Light-receiving module
AssigneeSumitomo Electric Industries, Ltd.
InventorsKenichiro Kohmoto, Takeshi Sekiguchi, Makoto Ito
Life of this patent
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Abstract
An optical module comprises a photodiode, an amplifying device, and a die capacitor. The die capacitor has at least a center pad, the photodiode is mounted thereon, and other pads on both side of the center pad. The die capacitor is mounted on a mounting surface of the module so as to locate the photodiode to be center of the surface. The amplifying device has a signal pad and a plural ground pad surrounding the signal pad. The signal pad is connected to the photodiode, while the ground pads are connected to the mounting surface through other pads on both side of the die capacitor.
Claims3
An optical module for receiving an optical signal, converting the optical signal to an electrical signal and outputting the electrical signal, comprising:
- a base having a mounting surface;
- a die capacitor provided on the mounting surface and having a first pad and a pair of second pads, the first pad and the pair of second pads being disposed so that the pair of second pads sandwiches the first pad therebetween;
- a semiconductor light-receiving device provided on said first pad of the die capacitor for receiving the optical signal and outputting a current signal corresponding to the optical signal;
- and
- a semiconductor electronic device having an inputting electrode for inputting the current signal from the light-receiving device and a pair of ground electrodes on both sides of the inputting electrode, the semiconductor electronic device being provided adjacent to the die capacitor so that the inputting electrode thereof opposes the outputting electrode of the semiconductor light-receiving device,
- wherein the ground electrodes of the electronic device are respectively connected to the second pads of the die capacitor and the second pads are respectively connected to the base.
The optical module according to clam 1, wherein the die capacitor further provides a third pad located outside of the second pad relatively to the first pad, and the semiconductor electronic device further provides a bias electrode connected to the third pad.
Dependencies are inferred from the claim text.