Multiple-function electronic chip
AssigneeSTMicroelectronics S.r.l.
InventorYvon Gris
Life of this patent
Estimating the term…
Abstract
An electronic chip formed of at least one second elementary chip set in first elementary chip so that the surfaces of the elementary chips are substantially in the same plane wherein the first elementary chip is formed of a heterogeneous substrate including a surface layer above a layer of different doping and defining at least one cavity extending the entire thickness of the second layer and at least one metal interconnection level connecting the at least one second elementary chip to the first elementary chip.
Claims26
An electronic chip formed of at least one second elementary chip set in a first elementary chip so that the surfaces of the elementary chips are substantially in the same plane, wherein:
- the first elementary chip is formed of a heterogeneous substrate including a surface layer above a layer of different doping and defining at least one cavity extending the entire thickness of the surface layer;
- and
- at least one metal interconnection level formed over the first and second elementary chips that connects said at least one second elementary chip to the first elementary chip.
A first chip configured to accommodate a second chip of known dimensions, the first chip comprising:
- a first layer substantially unresponsive to a first etch process;
- a second layer disposed above the first layer and responsive to the first etch process;
- and
- a cavity formed in the second layer and sized to accommodate a second chip of said known dimensions;
- further comprising a barrier layer separating the first chip from the second chip.
A compound chip, comprising:
- a first chip comprising a first layer substantially unresponsive to a first etch process, a second layer disposed above the first layer and responsive to the first etch process, and a cavity formed in the second layer;
- and
- a second chip disposed within the cavity formed in the first chip;
- further comprising a barrier layer separating the first chip from the second chip.
A composite electronic chip comprising at least one second elementary chip set into a first elementary chip so that the surfaces of the elementary chips are substantially in the same plane, wherein:
- the first elementary chip is formed of a heterogeneous substrate including a surface layer above a layer of different doping and defining at least one cavity extending into the substrate substantially the entire thickness of the surface layer and the surface layer being sufficiently thick that when said second elementary chip is set into said cavity, the surfaces of the elementary chips are substantially in the same plane;
- and
- at least one metal interconnection level formed over the first and second elementary chips that connects said at least one a second elementary chip to the first elementary chip.
Dependencies are inferred from the claim text.