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AssigneeMicron Technology, Inc.
InventorsDavid R. Hembree, Salman Akram, Derek Gochnour
Estimating the term…
A spring element used in a temporary package for testing semiconductors is provided. The spring element is compressed so as to press the semiconductor, either in the form of a bare semiconductor die or as part of a package, against an interconnect structure. The spring element is configured so that it provides sufficient pressure to keep the contacts on the semiconductor in electrical contact with the interconnect structure. Material is added and/or removed from the spring element so that it has the desired modulus of elasticity. The shape of the spring element may also be varied to change the modulus of elasticity, the spring constant, and the force transfer capabilities of the spring element. The spring element also includes conductive material to increase the thermal and electrical conductivity of the spring element.
A spring element comprising a first elastic member and a conductive member, said first elastic member being comprised of a first elastomeric material having a first modulus of elasticity, said first elastic member having a portion of said first elastomeric material removed, forming a hole in said first elastic member such that said spring element has an overall modulus of elasticity different from said first modulus of elasticity.
A spring element comprising a first elastic member, a second elastic member and a conductive member, said first elastic member being comprised of a first elastomeric material having a first modulus of elasticity, said second elastic member being comprised of a second elastomeric material having a second modulus of elasticity, said second elastic member positioned within said first elastic member such that said spring element has an overall modulus of elasticity different from said first and second moduli of elasticity.
A spring element comprising a plurality of elastomeric threads interwoven with conductive threads.
A spring element comprising a conductive member and an elastic member having a variable spring constant, said conductive member comprising a plurality of conductive particles disposed within said elastic member.
A spring element comprising a conductive member and an elastic member having a variable spring constant, said conductive member comprising a plurality of conductive particles disposed on top of said elastic member.
A spring element of comprising a conductive member and an elastic member, said conductive member comprising a layer of conductive material formed at least on a surface of or within said elastic member.
Dependencies are inferred from the claim text.