Infrared sensor device and manufacturing method thereof
AssigneeKabushiki Kaisha Toshiba
InventorsYoshinori Iida, Keitaro Shigenaka, Naoya Mashio
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Abstract
A supporting beam line for supporting, afloat in a cavity on a semiconductor substrate, an infrared detection pixel comprising an infrared absorption portion for absorbing an incident infrared ray and converting it into heat and a thermoelectric conversion portion for converting a temperature change caused by the heat generated in the infrared absorption portion into an electric signal is formed by a damascene metal on the same layer as the gate of a damascene metal gate MOS transistor to be used in a peripheral circuit. The supporting beam line comprises a conductor line with U-shaped cross section inside which a metal is filled.
Claims13
A method of manufacturing an infrared sensor, comprising:
- embedding a silicon oxide layer in a substrate comprising a single crystalline silicon supporting substrate, a silicon oxide film layer formed on the single crystalline silicon supporting substrate and a single crystalline silicon layer formed on the silicon oxide film layer, over a predetermined region of the single crystalline silicon layer;
- forming a thermoelectric converter pn junction for an infrared detection pixel in the single crystalline silicon layer;
- forming a supporting beam line including a U-shaped electric conductor on the silicon oxide layer while forming a gate electrode of a MOS transistor having an electric conductor with U-shaped cross section, the MOS transistor being included in a peripheral circuit on the single crystalline silicon layer;
- forming an infrared absorption layer on the single crystalline silicon layer;
- and
- forming a hole by etching for isolating the infrared detection pixel of the substrate from the substrate and suspending the infrared detection pixel within the hole by the supporting beam line.
A method of manufacturing an infrared sensor, comprising:
- forming an isolation recess region on an SOI substrate comprising at least a single crystalline silicon supporting substrate, a silicon oxide layer formed on the single crystalline silicon supporting substrate and a single crystalline silicon layer formed on the silicon oxide layer lay etching the single crystalline silicon layer;
- embedding an isolating silicon oxide film in the isolation recess region;
- forming a supporting beam line layer having a U shape simultaneously with the gate electrode of a damascene metal gate MOS transistor being formed on an element peripheral circuit;
- forming a thermoelectric conversion portion in the single crystalline silicon layer;
- forming a wiring for outputting an electric signal from the thermoelectric conversion portion;
- forming an infrared absorption layer on the single crystalline silicon layer;
- and
- forming a hole surrounding the thermoelectric conversion portion by etching for penetrating the single crystalline silicon layer and the silicon oxide layer of the SOI substrate to isolate the thermoelectric conversion portion from the SOI substrate to make an infrared detection pixel while forming a supporting beam fine supporting the infrared detection pixel.
A method of manufacturing an infrared sensor device, comprising the steps of:
- partitioning, on a single crystalline silicon substrate, locations for an infrared detection pixel, a peripheral circuit for reading out a signal from the detection pixel and a supporting beam line around the detection pixel for suspending the detection pixel and embedding a silicon oxide insulating layer at least at the location for the supporting beam line;
- forming a silicon protrusion on the insulating layer and forming a silicon nitride insulating layer on the sidewall thereof,
- eliminating the silicon protrusion and forming a conducting layer inside the silicon nitride insulating layer;
- depositing an infrared absorption layer on the detection pixel;
- and
- etching the periphery of the detection pixel, leaving the silicon nitride insulating layer and the conducting layer, to form a hole for disposing the detection pixel afloat from the substrate by using the insulating layer and the conductive layer as the supporting beam line.
Dependencies are inferred from the claim text.