Quasi-CW diode pumped, solid-state UV laser system and method employing same

A method for machining with a laser system through at least one layer of target material at multiple target areas on a work piece, the laser system employing a solid-state laser medium and a pumping source, the solid-state laser medium being limited in an amount of pumping power that the solid-state laser medium can tolerate over an extended period of time due to thermally-induced distortion, comprising:

• addressing a beam positioner toward a first target area on the work piece;
• supplying current at a first higher current level to the laser pumping source for pumping the solid-state laser medium during a first time interval;
• operating an intra-cavity acousto-optic Q-switch to generate a first laser output having at least two laser pulses at a repetition rate of at least 2 kHz during the first time interval;
• applying the first laser output to the first target area to remove target material from the first target area;
• reducing to a lower current level, the current supplied to the laser pumping source to reduce thermal load within the solid-state laser medium during a second time interval;
• addressing the beam positioner toward a second target area, different from the first target area, on the work piece during the second time interval;
• increasing to a second higher current level, the current supplied to the laser pumping source for pumping the solid-state laser medium during a third time interval;
• operating the Q-switch to generate a second laser output having at least two laser pulses at a repetition rate of at least 2 kHz during the third time interval;
• and
• applying the second laser output to the second target area to remove target material from the second target area.