Adhesive compositions containing organic spacers and methods for use thereof

An adhesive composition comprising at least one maleimide-containing monomer, optionally at least one cure initiator, and a plurality of spacers constructed from one or more organic polymers, wherein said spacers have a particle size in the range of about 0.02 mils up to about 25 mils.

An adhesive composition comprising at least one maleimide-containing monomer, optionally at least one cure initiator, and a plurality of spacers constructed from one or more organic polymers, wherein said organic polymers are polymerization or copolymerization products of α-olefins, (meth)acrylates, vinyl esters, acrylamides, or acrylonitriles.

An adhesive composition comprising in the range of about 1 wt % up to about 95 wt % at least one maleimide-containing monomer, in the range of about 0.2 wt % up to about 2.0 wt % at least one cure initiator, in the range of about 0.5 wt % up to about 5 wt % at least one coupling agent, in the range of about 1 wt % up to about 95 wt % at least one filler, and in the range of about 1 wt % up to about 50 wt % spacer constructed from one or more organic polymers.

An assembly comprising at least one semiconductor die, at least one substrate, and an adhesive composition forming a bond line therebetween, wherein the thickness of said bond line is determined by a plurality of spacers in said adhesive formulation.

An adhesive composition comprising at least one maleimide-containing monomer, optionally at least one cure initiator, and a plurality of spacers constructed from one of more organic polymers, wherein said spacers constructed from one or more organic polymers include at least one reactive moiety.