Method for forming an interface free layer of silicon on a substrate of monocrystalline silicon
AssigneeSTMicroelectronics S.r.l.
InventorsPeter Ward, Simona Lorenti, Giuseppe Ferla
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AssigneeSTMicroelectronics S.r.l.
InventorsPeter Ward, Simona Lorenti, Giuseppe Ferla
Estimating the term…
A method for forming an interface free layer of silicon on a substrate of monocrystalline silicon is provided. According to the method, a substrate of monocrystalline silicon having a surface substantially free of oxide is provided. A silicon layer in-situ doped is deposited on the surface of the substrate in an oxygen-free environment and at a temperature below 700° C. so as to produce a monocrystalline portion of the silicon layer adjacent to the substrate and a polycrystalline portion of the silicon layer spaced apart from the substrate. The silicon layer is heated so as to grow the monocrystalline portion of the silicon layer through a part of the polycrystalline portion of the silicon layer. Also provided is a method for manufacturing a bipolar transistor.
A method for forming an interface free layer of silicon on a substrate of monocrystalline silicon, the method comprising:
A method for forming an interface free layer of silicon on a substrate of monocrystalline silicon, the method comprising:
Dependencies are inferred from the claim text.