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US 6,806,167 B2Granted
Method of making chip-type electronic device provided with two-layered electrode
AssigneeRohm Co., Ltd.
InventorTakahiro Kuriyama
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Abstract
A method of making a chip-type electronic device includes a first through a third process steps. In the first step, a first electrode is formed on an insulating aggregate board. In the second step, a second electrode overlapping the first electrode is formed on the aggregate board. In the third step, the aggregate board is cut along a predetermined cutting line. The first electrode is formed as spaced from the cutting line, whereas the second electrode extends over the cutting line.
Claims5
A method of making a chip-type electronic device comprising the steps of:
- forming a first electrode on an aggregate board;
- forming a second electrode overlapping the first electrode;
- and
- cutting the aggregate board along a predetermined cutting line;
- the first electrode being spaced from the cutting line;
- wherein the aggregate board includes a cut region to be removed in the cutting step, the second electrode extending over the cut region, and
- the second electrode is less malleable than the first electrode.
4 more elements
Dependencies are inferred from the claim text.